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Polyimide Copolymers Containing Various Levels Of The 6F Moiety For High Temperature And Microelectronic Applications

Published online by Cambridge University Press:  15 February 2011

M. Haider
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
E. Chenevey
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
R. H. Vora
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
W. Cooper
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
M. Glick
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
M. Jaffe
Affiliation:
Hoechst Celanese Research Division, 86 Morris Avenue, Summit, New Jersey 07901
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Abstract

Trifluoromethyl group-containing polyimides not only show extraordinary electrical properties, but they also exhibit excellent long-term thermo-oxidative stability. Among the most thermomechanically stable structural polyimides are those from 6F dianhydride (6FDA) and 6F diamines. The effects of substituting non-fluorine containing monomers such as BTDA, mPDA and 4,4′-DADPS for the hexafluoroisopropylidene monomers on the dielectric, thermo-oxidative, thermal and mechanical properties of the copolymers were studied.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

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References

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