Poly(Arylene Ethers) as Low Dielectric Constant Materials for ULSI Interconnect Applications

Raymond N. Vrtis; Kelly A. Heap; William F. Burgoyne; Lloyd M. Robeson

doi:10.1557/PROC-443-171

Abstract

Poly(arylene ethers)s are low dielectric constant organic spin on materials. PAE-2, which is a non-fluorinated poly(arylene ether), exhibits a dielectric constant below 3.0, thermal stability greater than 425 °C as well as excellent adhesion to Si, SiO2, and Al. These are the major atributes which makes it a very attractive candidate for integration as an interlevel or inter-metal dielectric material (ILD). Material properties including dielectric constant, thermal stability, moisture absorption, and mechanical analysis will be discussed.

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Poly(Arylene Ethers) as Low Dielectric Constant Materials for ULSI Interconnect Applications

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This article has been cited by the following publications. This list is generated based on data provided by Crossref.

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Poly(Arylene Ethers) as Low Dielectric Constant Materials for ULSI Interconnect Applications

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