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PMODTM-based Direct Thin Film Imaging, DTFITM, on Flexible Substrates

Published online by Cambridge University Press:  15 February 2011

Paul J. Roman Jr ,
Harold O. Madsen ,
Seigi Suh ,
Leo G. Svendsen ,
Shyama P. Mukherjee ,
Aleta Jamora ,
Michael A. Fury  and
Katy Ip
Paul J. Roman Jr
Affiliation:
DuPont EKC Technology 2520 Barrington Ct., Hayward CA 94545
Harold O. Madsen
Affiliation:
DuPont EKC Technology 2520 Barrington Ct., Hayward CA 94545
Seigi Suh
Affiliation:
DuPont EKC Technology 2520 Barrington Ct., Hayward CA 94545
Leo G. Svendsen
Affiliation:
DuPont EKC Technology 2520 Barrington Ct., Hayward CA 94545
Shyama P. Mukherjee
Affiliation:
DuPont EKC Technology 2520 Barrington Ct., Hayward CA 94545
Aleta Jamora
Affiliation:
DuPont EKC Technology 2520 Barrington Ct., Hayward CA 94545
Michael A. Fury
Affiliation:
DuPont EKC Technology 2520 Barrington Ct., Hayward CA 94545
Katy Ip
Affiliation:
DuPont EKC Technology 2520 Barrington Ct., Hayward CA 94545
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Abstract

PMOD (Photochemical Metal Organic Deposition)-based DTFI (Direct Thin Film Imaging) methodology is a demonstrated means for patterning organic materials on flexible (plastic) substrates. This process is used to pattern 1-micron features at an aspect ratio of 8:1 using contact lithography. Use of oxygen plasma RIE etch to transfer the hard mask pattern to the organic material allows for good sidewall angle control. High etch selectivity between the novolac polymer and PMOD TiOX hard mask (< 800:1) makes the use of very thin hard masks (∼ 200 angstroms) to pattern thick organic films (<10 microns) possible. Selective removal of the PMOD TiOX (TiO2) hard mask makes this process amenable to patterning of functional organic structures fabricated from materials chosen for their desired properties (e.g., glass transition temperature (Tg), etch resisitance, optical properties, mechanical properties, etc.) not their ability to be photopatterned (e.g., photoresist).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 769: Symposium H – Flexible Electronics - Materials and Device Technology , 2003 , H5.1
Copyright
Copyright © Materials Research Society 2003

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