Hostname: page-component-78c5997874-94fs2 Total loading time: 0 Render date: 2024-11-16T15:00:59.659Z Has data issue: false hasContentIssue false

Planarization of Gratings using Magnetorheological Finishing

Published online by Cambridge University Press:  10 February 2011

Fuqian Yang
Affiliation:
Center for Optics Manufacturing, University of Rochester, 240 East River Road, Rochester, NY 14623
D. Golini
Affiliation:
Center for Optics Manufacturing, University of Rochester, 240 East River Road, Rochester, NY 14623 QED Technologies, LLC., 1080 University Avenue, Rochester, NY 14607
D. H. Raguin
Affiliation:
Rochester Photonics Corporation, 330 Clay Road, Rochester, NY 14623
S. D. Jacobs
Affiliation:
Center for Optics Manufacturing, University of Rochester, 240 East River Road, Rochester, NY 14623 Laboratory for Laser Energetics, University of Rochester, 240 East River Road, Rochester, NY 14623
Get access

Abstract

Surface planarization of BK7 glass gratings with periods of 130, 30, 16, 8 and 5 gm was performed with the magnetorheological finishing (MRF) process at the Center for Optics Manufacturing (COM). Approximately 0.5 μm of material was removed in the experiments. Grating height decreased as a function of grating period, going from ∼0.44 μm to ∼0.044 μm for a 130 μm period, and ∼0.44 μm to ∼30 Å for grating periods of 30, 16, 8 and 5 gm. The microroughness on ridges and in valleys of the grating structures also decreased with material removal from ∼100 Å to ∼10 Å for gratings with 30 and 16 μm periods.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tani, Y. and Kawata, K., Annals of the CIRP 33, p. 217 (1984)CrossRefGoogle Scholar
2. Kurobe, T., Imanaka, O. and Tachibana, S., Bull. Japan Prec. Eng. 17, p. 49 (1983)Google Scholar
3. Suzuki, H., Kodera, S., Hara, S., Matsunaga, H. and Kurobe, T., Prec. Eng. 4, p. 197 (1989)CrossRefGoogle Scholar
4. Suzuki, H., Kodera, S., Matsunaga, H. and Kurobe, T., J. Japan Soc. Prec. Eng. 59, p. 83 (1993)Google Scholar
5. Prokhorov, I., Kordonsky, W., Gleb, L. K., Gorodkin, G.R. and Levin, M.L., OSA OF&T Workshop Digest 24, p. 134 (1992)Google Scholar
6. Jacobs, S.D., Golini, D., Hsu, Y., Puchebner, B.E., Strafford, D., Kordonski, W., Prokhorov, I., Fess, E., Pietrowski, D., Kordonski, V., Proceeding of SPIE 2576, p. 2576 (1995)Google Scholar
7. Golini, D., Jacobs, S., Zhou, Y., Fess, E. and Atwood, M., OSA TOPS on Extreme Ultraviolet Lithography, 4, p. 98 (1996)Google Scholar
8. Komanduri, R., Umehara, N. and Raghunandan, M., J. Tribology, 118, p. 721 (1996)CrossRefGoogle Scholar
9. Sakaya, K., Kurobe, T., Suzuki, S. and Hirosaki, K., Int. J. Japan Soc. Prec. Eng. 30, p. 920 (1996)Google Scholar
10. Murphy, P., MRF Polishing of Silicon Surface Features, Senior Honors Project Final Report, Institute of Optics, University of Rochester, Rochester, NY, 1995. Patterned Si wafers were provided by M. Rothchild of MIT/LLGoogle Scholar
11. Bhushan, M., Rouse, R. and Lukens, J.E., J. Electrochem. Soc. 142, p. 3845 (1995)CrossRefGoogle Scholar
12. Cook, L.M., J. Non-Cryst. Solids, 120, p. 152 (1990)CrossRefGoogle Scholar
13. Steigerwald, J.M., Zirpoli, R., Murarka, S.P. and Gutmann, R.J., J. Electrochem. Soc. 142, p. 2841 (1994)Google Scholar
14. Jacobs, A. and Kilduff, T.F., Engineering Materials Technology, Prentice Hall Inc., Englewood Cliffs, NJ, 1985, pp. 144 Google Scholar