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Physical Characterization of Photosensitive Polyimide

Published online by Cambridge University Press:  15 February 2011

Y.L. Zou ,
T.L. Alford  and
J.W. Mayer
Y.L. Zou
Affiliation:
Department of Chemical, Bio and Materials Engineering, Center for Low Power Electronics, Arizona State University, Tempe, AZ 85287–6006
T.L. Alford
Affiliation:
Department of Chemical, Bio and Materials Engineering, Center for Low Power Electronics, Arizona State University, Tempe, AZ 85287–6006
J.W. Mayer
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287–1704
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Abstract

Polyimides prepared from oxydiphthalic anhydride and diamine precursors can be photosensitive. The thermal, mechanical, and dielectric properties of the polyimide films have been characterized with various techniques. The thermal decomposition temperature of the cured film is 520 °C, and the coefficient of thermal expansion is 20 × 10−6/°C. The polymer chemistry and processing conditions result in a low stress (<26 MPa) in the polyimide film as measured in situ during the curing and cooling cycles. Pads of 6 μm were patterned through the photosensitive polyimide at a sensitivity of 110 mJ/cm2 to i-line wavelength. The polyimide films exhibit anisotropy with an in-plane refractive index of 1.74 and an oul-of-plane index of 1.62 measured at 632.8 nm wavelength. This indicates a preferred orientation of polymer chains in the film plane. The estimated dielectric anisotropy should be considered a major factor for device design and optimization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 476: Symposium N – Low-Dielectric Constant Materials III , 1997 , 255
Copyright
Copyright © Materials Research Society 1997

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References

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