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Photosensitive Dielectric Film Developed Using a Polymer Blend
Published online by Cambridge University Press: 15 February 2011
Abstract
We developed a photosensitive film using a polymer blend for use in applications that require a high density of interconnects. Our film can be used as a dielectric or a passivation layer in high density packaging technologies. We formed vias about 20 μm in diameter using our new materials.
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- Copyright © Materials Research Society 1992