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Performance of Polishing Slurries containing Silica Particles grown by Sol-Gel Method

Published online by Cambridge University Press:  14 March 2011

Sun Hyuk Bae ,
Jae-Hyun So ,
Seung-Man Yang  and
Do Hyun Kim
Sun Hyuk Bae
Affiliation:
Department of Chemical Engineering, Korea Advanced Institute of Science and Technology 373-1, Kusong-dong, Yusung-gu, Taejon, 305-701, Korea
Jae-Hyun So
Affiliation:
Department of Chemical Engineering, Korea Advanced Institute of Science and Technology 373-1, Kusong-dong, Yusung-gu, Taejon, 305-701, Korea
Seung-Man Yang
Affiliation:
Department of Chemical Engineering, Korea Advanced Institute of Science and Technology 373-1, Kusong-dong, Yusung-gu, Taejon, 305-701, Korea
Do Hyun Kim
Affiliation:
Department of Chemical Engineering, Korea Advanced Institute of Science and Technology 373-1, Kusong-dong, Yusung-gu, Taejon, 305-701, Korea
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Abstract

Silica slurry used as abrasives in wafer polishing process is made by dispersing silica particles in an alkali solution. Since commercially available colloidal or fumed silica particles need some modifications to be directly used as abrasive slurry due to their small sizes, irregular shapes or broad size distribution, we have prepared silica abrasives by particle growth of fumed silica or colloidal silica as seeds by sol-gel method. Silica slurries prepared by this step-wise growth from commercial seeds were tested using one-armed polisher for the comparison with commercial slurries and showed the performance comparable to commercial slurries. Microstructures of polishing slurries were investigated using transmission electron microscopy and ARES rheometer. From the result, stability of the slurry was found to be more important than the primary particle sizes for the polishing performance.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 613: Symposium E – Chemical-Mechanical Polishing 2000 - Fundamentals… , 2000 , E6.5.1
Copyright
Copyright © Materials Research Society 2000

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References

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