Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-29T08:01:25.034Z Has data issue: false hasContentIssue false
  • English
  • Français

Peel Strength in the Cu/Cr/Polyimide System

Published online by Cambridge University Press:  15 February 2011

I. S. Park ,
Jin Yu  and
Y. B. Park
I. S. Park
Affiliation:
Department of Materials Science and Engineering, KAIST Chongryang P.O.Box 201, Seoul, Korea
Jin Yu
Affiliation:
Department of Materials Science and Engineering, KAIST Chongryang P.O.Box 201, Seoul, Korea
Y. B. Park
Affiliation:
Department of Materials Science and Engineering, KAIST Chongryang P.O.Box 201, Seoul, Korea
Get access

Abstract

In order to understand the effects of plastic deformation and the interfacial fracture energy on the peel strength, thickness of the metal layer and the pretreatment conditions of polyimide were varied in the Cu/Cr/polyimide system. The work expenditure during the peel test was estimated using the stress strain curves of metal films, X-ray measurements of the plastic strain in the peeled films, and the elastoplastic beam analysis. Results indicate that the peel strength is strongly affected by the film thickness and the pretreatment condition in a synergistic way, and that the measured peel strength is more a measure of the plastic deformation during the peel test than a measure of the true interfacial energy.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 133
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Evans, A. G., Harvard University, DAS report Mech-274, 1995.Google Scholar
2. Kim, K. S. and Aravas, N., Inst. J. Solids Struct. 24, 417(1988)Google Scholar
3. Kim, K. S. and Kim, J., Trans. ASME, J. Eng. Mater. Tech. 110, 266(1988)Google Scholar
4. Aravas, N., Kim, K. S. and Loukis, M. J., Materials Sci. and Eng., A7, 159(1989)Google Scholar
5. Kim, K. S., Mat. Res. Soc. Symp. Proc., 119, 31(1988)Google Scholar
6. Kim, J., Kim, K. S. and Kim, Y. H., Adhesion, J. Sci. Technol., 3, 175(1989)Google Scholar
7. Park, I. S., Ph. D. Thesis, to be published.Google Scholar
8. Chung, T. G., Kim, Y. H. and Yu, Jin, Adhesion, J. Sci. Technol., 8, 41,(1994)Google Scholar
9. Klug, Harold P. and Leory Alexander, E., X-Ray Diffraction Procedure, 2nd ed.(JOHN WILEY & SONS, New York, 1974) p6 Google Scholar
10. Leon Maissel, I. and Glang, Reinhard, Handbook of Thin Film Technology, (McGRAW HILL BOOK COMPANY, 1983), p. 12–44. Google Scholar
11. Yang, J. S., Ph. D. Thesis, Seoul National University, 1995.Google Scholar
12. Bunshah, R. F., Deposition Technologies for Films and Coatings, (NOYES PUBLICATIONS,1982) p385 Google Scholar
13. Chou, N. J. and Tang, C. H., J. Vac. Sci. and Technol., A2, 751(1984)Google Scholar
14. Jordan, J. L., Sanda, P. N., Morar, J. F., Kovac, C. A., Himpsel, F. J. and Pollak, R. A., J. Vac. Sci. and Technol., A4, 1046 (1986)Google Scholar
15. McMahon, C. J. and Jr, Vitek, V., Acta Met., 27,509(1979)Google Scholar
16. Rice, J. R. and Thomson, R., Phil. Mag., 29, 73(1974)Google Scholar
17. Park, I. S. and Yu, Jin, to be published.Google Scholar