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Parylene-PDMS Bilayer Coatings for Microelectronic and MEMS Packaging

Published online by Cambridge University Press:  26 February 2011

Hyungsuk Lee  and
Junghyun Cho
Hyungsuk Lee
Affiliation:
[email protected], SUNY at Binghamton, Mechanical Engineering, Vestal Pkwy East, Binghamton, NY, 13902-6000, United States
Junghyun Cho
Affiliation:
[email protected], SUNY at Binghamton, Mechanical Engineering, Vestal Pkwy East, Binghamton, NY, 13902-6000, United States
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Abstract

Current microelectronic devices and microelectromechanical systems (MEMS) require that packaging costs be reduced with more enhanced device performance. In addition, the packaging materials are often exposed to harsh environments, for which their performance is drastically degraded. Importantly, such devices become lighter and smaller, precluding the use of conventional packaging materials and schemes. Given that, surface coatings can provide an alternative solution for some of the aforementioned issues. Polydimethylsiloxane (PDMS) is a good candidate material in many encapsulating applications but its surface must be effectively protected due to its poor surface properties. In this study, the PDMS surface is coated with the parylene C film through a vapor-phase deposition. Proper surface modification of PDMS is then essential to generate desirable interfacial adhesion and performance between the parylene C and the PDMS. Effects of plasma treatment were examined in this study to evaluate their effectiveness on the surface modification of the PDMS. In order to explore mechanical performances of the bilayer coatings, dynamic nanoindentation and feedback-control nanoindentation testings were employed. In addition, extensive surface characterizations are performed with atomic force microscope (AFM) and optical microscope (OM).

Keywords

polymerpackagingcoating
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V07-07
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1. Lai, J.H., ed., Integrated circuit device encapsulation (CRC Press: Boca Raton, Fl., 1989), p. 63.Google Scholar
2. White, M.L., Proceedings of the IEEE, 57(9), (1969).Google Scholar
3. Lee, J.N., Park, C., and Whitesides, G.M., Anal. Chem., 75, (2003).Google Scholar
4. Soane, D.S. and Martnenko, Z., Polymers in Microelectronics. (Elsevier, New York, 1989), p. 213.Google Scholar
5. Wu, J., Pike, R.T., and Wong, C.P., IEEE Transaction on electronics packaging manufacturing, 22(3), (1999).Google Scholar
6. Fortin, J.B., Poly-para-xylylene thin films: A study of the deposition chemistry, kinetics, film properties, and film stability, in Engineering Science. 2001, Rensselaer Polytechnic Institute: Troy, NY.Google Scholar
7. Egitto, F.D. and Matienzo, L.J., IBM J. Res. Develop., 1994. 38(4): p. 423–439.Google Scholar
8. Francis, L.F., McCormck, A.V., and Vaessen, D.M., J. Mater. Sci., 2002. 37: p. 4717–4731.Google Scholar
9. Saha, R. and Nix, W.D., Acta Materialia, 2002. 50: p. 23–38.Google Scholar