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Orientation Characteristics with Process Parameters of PLZT(X/70/100) Thin Films Prepared by RF-Magnetron Sputtering

Published online by Cambridge University Press:  10 February 2011

S.K. Kang
Affiliation:
Department of Inorganic Materials Engineering, Kyungpook National University, Taegu, Korea
M.S. Park
Affiliation:
Department of Inorganic Materials Engineering, Kyungpook National University, Taegu, Korea
D.B. Kim
Affiliation:
LG Electro-Components Ltd., Osan-City, Kyungki-Do, Korea
K.S. No
Affiliation:
Department of Materials Science and Engineering, KAI ST, Taejon, Korea, [email protected]
S.H. Cho
Affiliation:
LG Electro-Components Ltd., Osan-City, Kyungki-Do, Korea
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Abstract

PLZT(X/70/100) thin films on MgO(100), Pt/Ti/MgO(100), and Pt/Ti/Si(100) have been prepared by RF-magnetron sputtering process from sintered target with compositions of PLZT(X/70/100), where X=5, 10, and 15, respectively. The effects of substrate temperature, substrate and gas pressure on deposited thin films were studied. Crystalline and surface characterization was analyzed using XRD, SEM, AES, and AFM. X-ray rocking curves were measured to examine the film orientation. It was observed that the gas pressure was the dominant influence on having (001) preferred orientation. As a result, the degree of c-axis orientation increased as gas pressure decreased.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCE

1. Sheppard, L. M., Ceram. Bull. 71 (1), 8595 (1992).Google Scholar
2. Haertling, G.H., Ceramic Materials for Electronics, 2nd ed. edited by Buchanan, R. C. (Marcel Dekker, New York, 1991) pp. 129206.Google Scholar
3. Meidong, L., Peiying, W., Churong, L., Guoan, W., Yunhua, R., and Yike, Z., Integrated Ferroelectrics. 5, 303 (1994).Google Scholar
4. Krupanidhi, S. B., Roy, D., Maffei, N., and Peng, C. J., Integrated Ferroelectrics. 1, 253 (1992).Google Scholar
5. Horwitz, J. S., Grabowski, K. S., Chrisey, D. B., and Leuchtner, R. E., Appl. Phys. Lett. 59[13] pp. 15651567(1991)Google Scholar
6. De Keijser, M., Dormans, G. J. M., Cillessen, J. F.M., and , Zandbergen, Appl. phys. Lett., 58 (23), 26362638 (1991).Google Scholar
7. Ye, C.P., Tamagawa, T., Lin, Y. Y., and Polla, D. L., MRS Symp. Proc. 243, 61 (1992).Google Scholar
8. Fujisawa, A., Shimizu, M. and Shiosaki, T., Integrated Ferroelectrics. 5, 255 (1994).Google Scholar