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Organo-Soluble, Segmented Rigid-Rod Polyimides: Synthesis and Properties

Published online by Cambridge University Press:  15 February 2011

F. W. Harris ,
S. L. C. Hsu ,
C. J. Lee ,
B. S. Lee ,
F. Arnold  and
S. Z. D. Cheng
F. W. Harris
Affiliation:
Institute and Department of Polymer Science, The University of Akron, Akron, OH 44325–3909, USA
S. L. C. Hsu
Affiliation:
Institute and Department of Polymer Science, The University of Akron, Akron, OH 44325–3909, USA
C. J. Lee
Affiliation:
Institute and Department of Polymer Science, The University of Akron, Akron, OH 44325–3909, USA
B. S. Lee
Affiliation:
Institute and Department of Polymer Science, The University of Akron, Akron, OH 44325–3909, USA
F. Arnold
Affiliation:
Institute and Department of Polymer Science, The University of Akron, Akron, OH 44325–3909, USA
S. Z. D. Cheng
Affiliation:
Institute and Department of Polymer Science, The University of Akron, Akron, OH 44325–3909, USA
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Abstract

Several segmented, rigid-rod polyimides have been prepared that are soluble in organic solvents in their fully imidized form. The polymers were prepared from commercial dianhydrides and 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (TFMB). Their intrinsic viscosities ranged from 1.0 to 4.9 dL/g. Tough, colorless films could be cast from m-cresol solutions at 100°C. The polymers had glass transition temperatures (Tgs) above 275°C and displayed outstanding thermal and thermo-oxidative stability. Fibers were prepared from the 3,3′,4,4′-tetracarboxybiphenyl dianhydride (BPDA) based polymers that had moduli of 130 GPa and tensile strengths of 3.2 GPa. The thermal expansion coefficients and dielectric constants of thin films (20–25 μm) of the polymers were as low as −2.40×10−6 and 2.5, respectively.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 3
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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