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Organic Electronics for Large Area Electronic Devices

Published online by Cambridge University Press:  15 February 2011

Marc Chason
Marc Chason*
Affiliation:
Motorola, Inc., Motorola Laboratories, Advanced Technology Center 1301 E. Algonquin Road, Schaumburg, IL, 60196, USA
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Abstract

With market opportunities continuing to drive electronic products to smaller size, significant research efforts continue to shrink semiconductor devices in accordance with Moore's Law. However, a new set of market opportunities is emerging for which the significant driver is not semiconductor complexity, but rather lower product cost arising from the novel integration of technologies making use of organic and flexible substrates. These new technologies present opportunities for research into new materials and fabrication processes. These new research opportunities extend from embedding passive devices, microfluidics, and polymeric optical waveguides in printed wiring boards, to organic transistors. This paper will discuss these new technologies and present some of the market forces driving these efforts.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 769: Symposium H – Flexible Electronics - Materials and Device Technology , 2003 , H3.1
Copyright
Copyright © Materials Research Society 2003

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References

1). “Simplifying PWB Assembly by Utilizing Embedded Passives”, Croswell, Robert, Savic, John, Partipilo, Phillip, SMTA 2002.Google Scholar
2.“Case Studies of Integrated Modules”, Croswell, Robert, Electronic Circuits World Convention 9.Google Scholar
3. Savic, John, Croswell, Robert T., Tungare, Aroon, Dunn, Greg, Tang, Tom, Lempkowski, Robert, Zhang, Max, Lee, Tien, Circuitree, p.10, June, 2002.Google Scholar
4.“Development of MEMS on Printed Wiring Board Platform”, Lian, Keryn, O'Rourke, Shawn, Eliacin, Manes, Gamboa, Claudia, Terbrueggen, Robert, Sadler, Daniel and Chason, Marc, APEX2003.Google Scholar
5.“Electro-Optical Printed Circuit Board (EOPCB)”, Schmeider, Kai, Wolter, Klaus-Jurgen, IEEE Electronics Components and Technology Conference, 2000.Google Scholar
6.Optical Crosslinks website, www.opticalcrosslink.com, and the links therein.Google Scholar
7. Bao, Z. and Lovinger, A. J., “Soluble Regioregular Polythiophene Derivatives as Semiconducting Materials for Field-Effect Transistors,” Chemistry of Materials, vol. 11, pp. 2607–2612, 1999.Google Scholar
8. Kagan, C. R., Mitzi, D. B., and Dimitrakopoulos, C. D., “Organic-Inorganic Hybrid Materials as Semiconducting Channels in Thin-Film Field-Effect Transistors,” Science, vol. 286, no. 5441, pp. 945–947, 1999.Google Scholar
9. Sirringhaus, H., Friend, R. H., Wang, C., Leuninger, J., and Mullen, K., “Dibenzothienobisbenzothiophene -- A Novel Fused-Ring Oligomer With High Field-Effect Mobility,” Journal of Materials Chemistry, vol. 9, pp. 2095–2101, 1999.Google Scholar
10. Bao, Z., Lovinger, A. J., and Brown, J., “New Air-Stable n-Channel Organic Thin Film Transistors,” Journal of the American Chemical Society, vol. 120, pp. 207–208, 1998.Google Scholar
11.“Standardization for Printed Electronics: An Overview of Recent Activities”, Brazis, Paul, Gamota, Dan, 2003 IMAPS Advanced Technology Workshop on Printing an Intelligent World.Google Scholar