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Optical Furnace Annealing
Published online by Cambridge University Press: 25 February 2011
Abstract
The rapid annealing of Be implanted GaAs has produced electrical activations of 70% for doses of 5 × 1014 cm−2 and hole profiles similar to the as implanted distribution. Si implanted GaAs has also been investigated using doses of 1 and 2 × 1014 cm−2 with sheet resistivities of 40 Ω/square after rapid thermal annealing. GaAs has been annealed with W-Si on the surface for the application of self aligned gate FET technology. Temperature cycles upto 850°C are required to activate the implanted dopant. Such cycles do not cause inter diffusion between the W-Si and GaAs or deterioration of the metallisation surface morphology.
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- Copyright © Materials Research Society 1985
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