Hostname: page-component-78c5997874-s2hrs Total loading time: 0 Render date: 2024-11-19T04:34:19.626Z Has data issue: false hasContentIssue false
  • English
  • Français

On the Mechanical Properties of a Poly(oxazolidone) Polymer for Encapsulant Applications

Published online by Cambridge University Press:  10 February 2011

M. Manoharan  and
K. S. Chian
M. Manoharan
Affiliation:
Division of Materials Engineering, School of Applied Science; [email protected]
K. S. Chian
Affiliation:
Division of Manufacturing Engineering, School of Mechanical and Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798.
Get access

Abstract

Epoxy based resins have been widely used as encapsulation materials in microelectronics components due to their good mechanical, thermal and electrical properties, outstanding adhesion to various substrates and the ability to be processed under a variety of conditions. These epoxy resins have a high glass transition temperature but low toughness and damage tolerance. As electronic devices continue to be miniaturized and the scale of integration increases, the encapsulation of these chips leads to mechanical and thermal stress related failures. Mechanical stresses could result from the mismatch in thermal expansion rates between the polymeric encapsulant, the silicon chip and the metal leadframe. The accommodation of these stresses may lead to cracking of the encapsulant or delamination. In this study, poly(oxazolidone) polymer was prepared by reacting 4,4′-Diphenyl-methanediisocyanate (MDI) with diglycidyl ether of bisphenol A (DGEBA) at elevated temperature. The mechanical properties of this polymer were investigated both as a stand-alone material as well as a bi-material sandwich with a brittle substrate. The degree of cracking in the substrate is shown to be a function of the thickness of the polymer layer. This result is analyzed based on the variation in the position of the neutral axis in this composite.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 209
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Wang, J.S. and Suo, Z., Acta Metall., 38, p. 1279 (1990).Google Scholar
2. Shih, C.F. and Asaro, R.J., J. App. Mech., 55, p. 299, (1988).Google Scholar
3. Manoharan, M., Scr. Metall. Mater., 26, p. 1187 (1992).Google Scholar
4. Manoharan, M., Hirth, J.P. and Rosenfield, A.R., J. Test. Eval., 18, 106 (1990).Google Scholar
5. Manoharan, M., Scr. Metall. Mater., 30, 1383 (1994).Google Scholar
6. Jones, J.I. and Savill, N.G., J. Chem. Soc., 4, p. 4392, (1957)Google Scholar
7. Speranza, G.P. and Peppel, W.J., J. Org. Chem., 23, p.1922, (1958)Google Scholar
8. Herweh, J.E., Heterocyclic Chem., 5, p. 687, (1968).Google Scholar
9. Kinjo, N., Numata, S.I., Koyama, T., and Narahara, T., J. App. Poly. Sci., 28, p. 1729, (1983)Google Scholar
10. Kordomenos, P.I., Frisch, K.C., and Eresta, J., J. Coat. Tech., 55, p. 49, (1983)Google Scholar
11. Disalvo, A.L. and Tsai, C.C.,, US Patent 4,386,191, (1983).Google Scholar
12. Sendijarevic, A., Sendijarevic, V., Frisch, K.C.L., Poly. Sci., Pt(C), 28, 199, (1990)Google Scholar
13. Senger, J.S., Yilgor, Z., and McGrath, J.E., ACS Poly. Preperation., 26, 244, (1985).Google Scholar
14. Manoharan, M. and Chian, K.S. in Processing and Fabrication of Advanced Materials VI, Edited by K.A. Khor and T.S. Srivatsan, Singapore, in press.Google Scholar
15. Freund, L.B. in Thin Films: Stresses and Mechanical Properties VI, Edited by Gerberich, William W., Gao, Huajian, Sundgren, Jan-Eric, Baker, Shefford P., (Mater. Res. Soc. Proc. 403, Pittsburgh, PA, 1997), p. 393.Google Scholar
16. Freund, L.B., J. Crystal Growth, 132, p. 341, (1993).Google Scholar