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On the Evolution of Surface Morphology of Polysilicon Mems Structures During Fatigue

Published online by Cambridge University Press:  17 March 2011

S. M. Allameh
Affiliation:
The Princeton Materials Institute and The Department of Mechanical and Aerospace Engineering, Princeton University, 1 Olden Street, Princeton, NJ 08544
B. Gally
Affiliation:
Exponent Failure Analysis and Associates, 21 Strathmore Road, Natick, MA 01760
S. Brown
Affiliation:
Exponent Failure Analysis and Associates, 21 Strathmore Road, Natick, MA 01760
W.O. Soboyejo
Affiliation:
The Princeton Materials Institute and The Department of Mechanical and Aerospace Engineering, Princeton University, 1 Olden Street, Princeton, NJ 08544
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Abstract

This paper presents the results of an atomic force microscopy (AFM) study of the evolution of surface topology in notched polysilicon MEMS structures deformed under cyclic loading at room temperature. The in-situ and ex-situ AFM studies reveal changes in surface topology after cyclic actuation at a relative humidity of ∼70%. These lead ultimately to large wavelength modulations close to the bottom of the notch, in the areas where the tensile stresses are maximum. This is in contrast with the wavelength of the surface modulations away from the notch, which remain relatively unchanged. The results are discussed in terms of possible chemical/surface processes that can occur in the presence of water vapor.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Wise, K.D. and Najafi, K., Science, 254, p. 1335, (1991).Google Scholar
2. Madou, M., Fundamentals of Microfabrication, CRC Press, New York, 1997.Google Scholar
3. Togawa, T., Biomedical Transducers and Instruments, CRC Press, 1997.Google Scholar
4. Connally, J.A. and Brown, S.B., Science, 256, p. 1537 (1992).Google Scholar
5. Connally, J.A. and Brown, S.B., Experimental Mechanics, p. 81, (June 1993).Google Scholar
6. Brown, S., Povuk, G. and Connally, J., Measurement of Slow Crack Growth in Silicon and Nickel Micromechanical Devices, Proceedings of MEMS-93, Fort Lauderdale, FL, Feb. 7-10, 1993) p. 99.Google Scholar
7. Brown, S.B., W. Van Arsdell, Muhlstein, C.L., Materials Reliability in MEMS Devices, Proc. Transducers 97, Vol. 1, pp. 607610 (1997).Google Scholar
8. Kahn, H., Ballarini, R., Mullen, R. L. and Heuer, A. H., Proc. Roy. Soc., Series A (Mathematical, Physical and Engineering Sciences) 455, no.1990 3807–23.Google Scholar
9. Arsdell, W. Van and Brown, S., J. Microelectromech. Syst., 46, p. 320 (1999).Google Scholar
10. Freeman, D. M., Aranyosi, A. J., Gordon, M. J., Proc. Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, pp. 150155, June 1998.Google Scholar
11. Yang, W.H. and Srolovitz, D.J., J. Mech. Phys. Solids, 42, No. 10, p. 1551 (1994).Google Scholar
12. Liang, J. and Suo, Z., “Stress-Assisted Reactions at a Solid-Fluid Interface”, Private Communication.Google Scholar