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Observation of Glass Transition Temperatures in Polymeric Thin Films by Wafer Curvature Measurements

Published online by Cambridge University Press:  22 February 2011

P. H. Townsend
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland. Ml 48674
B. S. Huber
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland. Ml 48674
D. S. Wang
Affiliation:
The Dow Chemical Company, CASAL, B-1811 Building, Freeport, TX 77541.
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Abstract

Wafer bending measurements have been used to study the glass transition temperature, Tg, of thin coatings of polystyrene and polycarbonate on Si wafers. The observed values of Tg agree with DSC and TMA measurements on bulk samples. The evolution of the substrate curvature has been used to examine the behavior of Tg in thin epoxy films and coatings derived from divinylsiloxane bisbenzocyclobutene, mixed stereo and positional isomers of 1, 3-bis(2-bicyclo[4.2.0]octa-1, 3, 5-trien-3-ylethenyl)-1, 1, 3, 3-tetramethyl disitoxane (CAS 117732–87–3). The dependence of the Tg of the epoxide coatings is studied as a function of the cross-linking. The evolution of the Tg in the benzocyclobutene coating is found to be a monotonie function of the level of conversion of the polymer network.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

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