Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2024-12-27T01:38:24.603Z Has data issue: false hasContentIssue false
  • English
  • Français

A Novel Technique to Determine Elastic Constants of Thin Films

Published online by Cambridge University Press:  01 February 2011

Klaus Martinschitz ,
Rostislav Daniel ,
Christian Mitterer  and
Keckes Jozef
Klaus Martinschitz
Affiliation:
[email protected], Austrian Academy of Sciences, Leoben, Austria
Rostislav Daniel
Affiliation:
[email protected], University of Leoben, Leoben, Austria
Christian Mitterer
Affiliation:
[email protected], University of Leoben, Leoben, Austria
Keckes Jozef
Affiliation:
[email protected], University of Leoben, Austria
Get access

Abstract

A new X-ray diffraction technique to determine elastic moduli of polycrystalline thin films deposited on monocrystalline substrates is demonstrated. The technique is based on the combination of sin2ψ and X-ray diffraction wafer curvature techniques which are used to characterize X-ray elastic strains and macroscopic stress in thin film. The strain measurements must be performed for various hkl reflections. The stresses are determined from the substrate curvature applying the Stoney's equation. The stress and strain values are used to calculate hkl reflection dependent X-ray elastic moduli. The mechanical elastic moduli can be then extrapolated from X-ray elastic moduli considering film macroscopic elastic anisotropy. The derived approach shows for which reflection and corresponding value of the X-ray anisotropic factor Γ the X-ray elastic moduli are equal to their mechanical counterparts in the case of fibre textured cubic polycrystalline aggregates. The approach is independent of the crystal elastic anisotropy and depends on the fibre texture type, the texture sharpness, the amount of randomly oriented crystallites and on the supposed grain interaction model. The new method is demonstrated on a fiber textured Cu thin film deposited on monocrystalline Si(100) substrate. The advantage of the new technique remains in the fact that moduli are determined non-destructively, using a static diffraction experiment and represent volume averaged quantities.

Keywords

thin filmmetalx-ray diffraction (XRD)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG03-31
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Suresh, S., Freund, L.B., Thin Film Materials Stress, Defect Formation and Surface Evolution. Cambridge: Cambridge University Press (2003).Google Scholar
2. Cavaleiro, A., De Hosson, J. T., Nanostructured Coatings. New York: Springer (2006).Google Scholar
3. Eiper, E., Martinschitz, K.J., Gerlach, J.W., Lackner, J.M., Zizak, I., Darowski, N., Keckes, J., Z.Metallkd. 96, 1069 (2005).Google Scholar
4. Eiper, E., Martinschitz, K.J., Keckes, J., Powder Diffr. 21, 25 (2006).Google Scholar
5. Martinschitz, K.J., Eiper, E., Massl, S., Kostenbauer, H., Daniel, R, R., , Fontalvo, G., Mitterer, C., and Keckes, J., J. Appl. Cryst. 39, 777 (2006).Google Scholar
6. Hill, R., Proc. Phys. Soc. London, Sect A 65, 349 (1952).Google Scholar
7. van Houtte, P. and De Buyser, L., Acta metall. mater. 41, 323 (1993).Google Scholar
8. Bollenrath, F., Hauk, V., Müller, E.H., Z. MetaIlkd. 58, 76 (1967).Google Scholar
9. Reuss, A., Z.Angew. Math.Mech. 9, 49 (1929).Google Scholar
10. Noyan, I.C., Cohen, J.B., Residual Stress Measurement by Diffraction and Interpretation. Springer. (1987).Google Scholar
11. Stoney, G.G., P. Roy. Soc.Lond. A 82, 172 (1909).Google Scholar
12. Keckes, J., Eiper, E., Martinschitz, K.J., Koestenbauer, H., Daniel, R., Mitterer, C., Rev.Sci. Instrum. 78, 036103 (2007).Google Scholar