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A novel fabrication technique by composite material processing: Integrated metal-insulator-semiconductor fibers and fiber devices

Published online by Cambridge University Press:  01 February 2011

Mehmet Bayindir ,
Ayman F. Abouraddy ,
Ofer Shapira ,
Jeff Viens ,
John D. Joannopoulos  and
Yoel Fink
Mehmet Bayindir
Affiliation:
[email protected], MIT, Research Laboratory of Electronics, 50 Vassar Street, Room: 36-229, Cambridge, MA, 02139, United States
Ayman F. Abouraddy
Affiliation:
[email protected], Massachusetts Institute of Technology, Research Laboratory of Electronics, United States
Ofer Shapira
Affiliation:
[email protected], Massachusetts Institute of Technology, Research Laboratory of Electronics, United States
Jeff Viens
Affiliation:
[email protected], Massachusetts Institute of Technology, Research Laboratory of Electronics
John D. Joannopoulos
Affiliation:
[email protected], Massachusetts Institute of Technology, Research Laboratory of Electronics
Yoel Fink
Affiliation:
[email protected], Massachusetts Institute of Technology, Research Laboratory of Electronics
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Abstract

Fabrication of functional devices in fibers by thermal drawing requires a material identification scheme and challenging composite material processing. A macroscopic preform rod containing metallic, semiconducting and insulating constituents in a variety of geometries and close contact leads to kilometer-long novel optoelectronic, and thermal mesoscopic fiber devices. The preform-to-fiber approach yields spectrally tunable photodetectors and integrated self-monitoring fibers.

Keywords

fiberlaseroptoelectronic
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 888: Symposium V – Materials and Devices for Smart Systems II , 2005 , 0888-V06-18
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

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