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Nist Program on Measurements of the Properties of Materials in Electronic Packaging

Published online by Cambridge University Press:  25 February 2011

Joseph A. Carpenter Jr.
Joseph A. Carpenter Jr.*
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899
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Abstract

Reduction in the feature sizes of electronic chips is forcing a commensurate decrease inthe sizes of the various structures in packaging so that the assumption that the materials of the structures have bulk properties is suspect, especially near the interfaces. Historically, packaging has not received research and development as sophisticated as thatof the chip, so a collection of techniques specific to packaging technology has not beendeveloped. The National Institute of Standards and Technology (NIST) has identified the need for and initiated efforts to develop and refine such techniques. This paper will discuss the current NIST program and plans which were developed in conjunction with industry and other government agencies. Initial attention is given to measurements of the electrical, thermal, mechanical, and chemical properties of all types of materials used in the packaging.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 119
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

1. McCall, D. W., chairman, Materials for High-Density Electronic Packaging and Interconnection, Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, the National Research Council (NMAB-449, National Academy Press, Washington, DC, 1990).Google Scholar
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