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A New Self-Aligned Poly-Si Tft Employing a Pre-Patterned Al Mask Layer by Backside Exposure Technique
Published online by Cambridge University Press: 01 February 2011
Abstract
A new self-aligned poly-Si TFT has been fabricated by employing a photoresist backside exposure technique. A pre-patterned aluminum (Al) layer on a-Si film not only induces the lateral grain growth (∼1.6 μm) in excimer laser crystallization but also implements the selfalignment of the gate region with the lateral grain region. Photoresist backside exposure through poly-Si film has been successfully performed because crystallized poly-Si has a fairly high UV transmittance. A self-aligned poly-Si TFT with a single grain boundary within the 2 μm channel was successfully fabricated and high on/off current ratio (∼107) was obtained.
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- Copyright © Materials Research Society 2002
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