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New Reliable Structure for High Temperature Measurement of Silicon Wafers Using a Specially Attached Thermocouple

Published online by Cambridge University Press:  22 February 2011

S.A. Cohen ,
T.O. Sedgwick  and
J.L. Speidell
S.A. Cohen
Affiliation:
IBM T. J. Watson Research Center Yorktown Heights, New York 10598
T.O. Sedgwick
Affiliation:
IBM T. J. Watson Research Center Yorktown Heights, New York 10598
J.L. Speidell
Affiliation:
IBM T. J. Watson Research Center Yorktown Heights, New York 10598
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Abstract

Accurate wafer temperature measurement is very important in the area of material processing. In Short Time Annealing, for example, it is necessary to monitor temperature peaks of up to 1200°C which are only a few seconds in duration. This paper describes a structure consisting of a silicon wafer with a specially attached thermocouple. This structure is capable of reliable high temperature measurements of up to 1200°C and is also capable of surviving repeated cycling at that temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 23 , 1983 , 321
Copyright
Copyright © Materials Research Society 1984

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References

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