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A New, Reliable Snap Cure Die Attach Adhesive.

Published online by Cambridge University Press:  15 February 2011

David P. Galloway  and
My N. Nguyen
David P. Galloway
Affiliation:
Motorola Inc., 2100 E. Elliot Rd., Tempe, AZ 85284 Johnson Matthey Electronics, 10080 Willow Creek Rd., San Diego, CA 92131
My N. Nguyen
Affiliation:
Motorola Inc., 2100 E. Elliot Rd., Tempe, AZ 85284 Johnson Matthey Electronics, 10080 Willow Creek Rd., San Diego, CA 92131
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Abstract

With the advent of new in-line assembly techniques and equipment such as high temperature wirebonders, equipped with rapid cure stations, came the need to develop a suitable, adhesive with high performance characteristics. Typical traditional die attach adhesives were found to be inadequate.

The higher performance characteristics were determined by assembly characterization studies. A new type of rapid cure thermoset dieattach adhesive was then developed to fill the need of these more rigorous assembly requirements.

Early testing showed the new material to possess the desired attributes, such as < 1% wt loss during cure, thermal stability well above 300°C, low ionic species and excellent adhesion strength after cure. In addition, the material is suitable for syringe dispensing at high speeds.

In this paper, we will review the process performance goals, the material evaluation strategy, the various types of screening tests performed on all samples, and some of the findings from the assembly characterization studys. We will conclude with the reliability test results, comparing this new material with four other die attach adhesive samples. Emphasis is given to the overall success of using this evaluation strategy and to the reliable results of this new adhesive used in plastic Dual-in-line packages.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 271
Copyright
Copyright © Materials Research Society 1992

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References

[1] Khan, M., et al “Aluminum Bond Pad Contamination by Thermal Outgassing of Organic Material from Silver-Filled Epoxy Adhesives,” in Proc. IEEE Electronic Component Conf., Boston, 1987.Google Scholar
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