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A New Method of Depositing Amorphous Hydrogenated Silicon Carbide with Low Ir-Detected Microstructure

Published online by Cambridge University Press:  21 February 2011

Hsueh Yi Lu
Affiliation:
Department of Chemical Engineering, Northwestern University, Evanston, Illinois 60208–3120
Mark A. Petrich
Affiliation:
Department of Chemical Engineering, Northwestern University, Evanston, Illinois 60208–3120
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Abstract

We report a new method of depositing amorphous hydrogenated silicon carbide thin films with low IR-detected microstructure in a plasma-enhanced chemical vapor deposition reactor. Films prepared at various conditions are studied with Fourier-transform infrared absorption. Their optical band gaps and photoconductivities are also measured. The amount of microstructure can be controlled by adjusting the powered-electrode potential during deposition, and the microstructural changes are reflected in the film properties. By applying an external dc voltage to the rf-excited powered electrode, we can shift the optimal deposition temperature from 250 °C to as low as 100 °C. We find that films deposited at positive powered-electrode potential and low substrate temperature exhibit less microstructure, wider optical band gaps, and faster deposition rates than films deposited at conventional conditions.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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