Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-29T07:32:22.742Z Has data issue: false hasContentIssue false

Nanostructured silicon films produced by PECVD

Published online by Cambridge University Press:  17 March 2011

R. Martins
Affiliation:
CENIMAT, DCM- FCT/UNL and CEMOP/UNINOVA, Quinta da Torre, 2825-114 Monte de Caparica, Portugal
H. Águas
Affiliation:
CENIMAT, DCM- FCT/UNL and CEMOP/UNINOVA, Quinta da Torre, 2825-114 Monte de Caparica, Portugal
V. Silva
Affiliation:
CENIMAT, DCM- FCT/UNL and CEMOP/UNINOVA, Quinta da Torre, 2825-114 Monte de Caparica, Portugal
I. Ferreira
Affiliation:
CENIMAT, DCM- FCT/UNL and CEMOP/UNINOVA, Quinta da Torre, 2825-114 Monte de Caparica, Portugal
A. Cabrita
Affiliation:
CENIMAT, DCM- FCT/UNL and CEMOP/UNINOVA, Quinta da Torre, 2825-114 Monte de Caparica, Portugal
E. Fortunato
Affiliation:
CENIMAT, DCM- FCT/UNL and CEMOP/UNINOVA, Quinta da Torre, 2825-114 Monte de Caparica, Portugal
Get access

Abstract

This paper presents the process conditions that lead to the production of nanostructured silicon films grown by plasma enhanced chemical vapour deposition close to the so-called gamma regime (powder formation), highly dense and with low density of bulk states. Thus, the powder management is one important issue to be addressed in this paper. As a general rule we observed that high quality films (low density of states and high μτ products) are obtained when films are grown under low ion bombardment at high hydrogen dilution and deposition pressure conditions, to allow the proper surface passivation and surface activation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Bruno, G., Capezzuto, P. and Cicala, G. in Amorphous silicon based devices, edited by Bruno, G., Capezzuto, P. and Madan, A. (Academic Press, 1995) pp. 157.Google Scholar
2. Steinbrüchel, Ch. in Physics of Thin films, edited by Francombe, M.H & Vossen, J.L., (Academic Press, 1994) 18, 289.Google Scholar
3. Hershkowitz, N. (ed.), “Formation, Transport and Consequences of Particles in Plasmas”, Plasma Sources Sci. & Technol. (1994) 3, 239.Google Scholar
4. Bouchoule, A. (Ed.), “Dusty Plasmas, Physics, Chemistry and Technological Impacts in plasma processing”, (John Wiley & Sons, 1999).Google Scholar
5. Cabarrocas, P. Roca I, J. of non-Cryst. Sol. 266–269, 31 (2000).Google Scholar
6. Hadjadj, A., Boufendi, L., Huet, S., Schelz, S., Cabarrocas, P. Roca i, Estrade-Szwarckopf, H., and Rousseau, B., J. Vac. Sci. Technol. A, 18(2), 529 (2000).Google Scholar
7. Martins, R., Águas, H., Ferreira, I., Silva, V., Cabrita, A. and Fortunato, E.. Thin Sol. Films, 383, 165 (2001).10.1016/S0040-6090(00)01597-2Google Scholar
8. Martins, R., Ferreira, I., Domingues, A. and Fortunato, E., Vacuum, 56, 25 (2000).Google Scholar
9. Morosoff, N., “Plasma Deposition, Treatment and Etching of Polymers”, edited by d'Agostino, R. (Academic Press, 1990) pp. 193.Google Scholar
10.A.Bell, T., Top. Curr. Chem. 94, 59 (1980).Google Scholar
11. Águas, H., Fortunato, E., Martins, R., Vacuum, 56, 31 (2000).Google Scholar
12. Giorgis, F., Giuliani, F., Pirri, C.F., Tresso, E. and Coscia, U., “Properties of Amorphous Silicon and its Alloys”, ed. Searle, T. (IEE EMIS DATA review series, 1998) pp. 168179.Google Scholar
13. Lucovsky, G., Nemanich, R., Knights, J., Phys. Rev. B 19, 2064 (1979).Google Scholar
14. Águas, H., Martins, R., Fortunato, E, Vacuum, 2000, 60, 247 (2001).10.1016/S0042-207X(00)00391-2Google Scholar
15. Courteille, C., Hollenstein, CH., Dorier, J-L., Gay, P., Schwarzenbach, W., Howling, A.A., Bertran, E., Vera, G., Martins, R. and Maçarico, A., J. App. Phys 80, 2069 (1996).Google Scholar
16. Hofmeister, H., Dutta, J., Hofmann, H., Phys. Rev. B., 54, 2856 (1996).Google Scholar
17. Delrue, C., Allan, G., Lanno, M., Phys. Rev. B, 84 (1998).Google Scholar