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Nanoparticle Enhanced Solders for Increased Solder Reliability

Published online by Cambridge University Press:  10 May 2012

Omid Mokhtari ,
Ali Roshanghias ,
Roya Ashayer ,
Hiren R Kotadia ,
Farzad Khomamizadeh ,
Amir H Kokabi ,
Michael P Clode ,
Mark Miodownik  and
Samjid H Mannan
Omid Mokhtari
Affiliation:
Department of Physics, King’s College London, London, UK
Ali Roshanghias
Affiliation:
Department of Mechanical Engineering, King’s College London, London, UK
Roya Ashayer
Affiliation:
Department of Mechanical Engineering, King’s College London, London, UK
Hiren R Kotadia
Affiliation:
Department of Physics, King’s College London, London, UK
Farzad Khomamizadeh
Affiliation:
Department of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran
Amir H Kokabi
Affiliation:
Department of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran
Michael P Clode
Affiliation:
Department of Mechanical Engineering, King’s College London, London, UK
Mark Miodownik
Affiliation:
Department of Physics, King’s College London, London, UK
Samjid H Mannan
Affiliation:
Department of Physics, King’s College London, London, UK
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Abstract

Due to environmental concerns traditional eutectic tin-lead solder is gradually being replaced in electronic assemblies by “lead-free” solders. During this transition, nanoparticle technology is also being investigated to see whether improvements in joint reliability for high temperature applications can be made. Nanoparticles can be used to harden the solder via Zener pinning of the grain boundaries and reduce fatigue failure. This paper explores the effects of adding Silica nanoparticles to SnAgCu solder, and how the mechanical properties induced in the solder vary with temperature. It is found that above 100 °C the mechanical response and microstructure of the normal and nanoparticle enhanced solders converge.

Keywords

solderingcompositemicroelectronics
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1424: Symposium SS – Properties and Processes at the Nanoscale Nanomechanics of Material Behavior , 2012 , mrsf11-1424-ss15-18
Copyright
Copyright © Materials Research Society 2012

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References

1. Anderson, I.E., J. Mater. Sci-Mater. El. 18, 55 (2007).Google Scholar
2. Sundelin, J.J., Nurmi, S.T., Lepisto, T.K. and Ristolainen, E.O., J. Electron. Mater. 35, 1600 (2006).Google Scholar
3. Hao, H., Tian, J., Shi, Y.W., Lei, Y.P. and Xia, Z.D., J. Electron. Mater. 36, 766 (2007).Google Scholar
4. Chen, S.W. and Chang, C.A., J. Electron. Mater. 33, 1071 (2004).Google Scholar
5. Hwang, C.W., Kim, K.S. and Suganuma, K., J. Electron. Mater. 32, 1249 (2003).Google Scholar
6. Mavoori, H. and Jin New, S., J. Electron. Mater. 27, 1216 (1998).Google Scholar
7. Song, K. and Aindow, M., Mat. Sci. Eng. A-Struct. 479, 365 (2008).Google Scholar
8. Chang, K.N., Feng, W.M. and Chen, L.Q., Acta Mater. 57, 5229 (2009).Google Scholar
9. Smith, C.S., Trans. Am. Inst. Min. Metall. Eng. 175, 15 (1948).Google Scholar
10. Liu, Y.X. and Patterson, B.R., Acta Mater. 44, 4327 (1996).Google Scholar
11. Hazzledine, P.M. and Oldershaw, R.D.J., Philos. Mag. A 61, 579 (1990).Google Scholar
12. Shi, Y.W., Liu, J.P., Xia, Z.D., Lei, Y.P., Guo, F. and Li, X.Y., J. Mater. Sci-Mater. El. 19, 349 (2008).Google Scholar
13. Ashayer, R., Mannan, S.H. and Sajjadi, S., Colloid Surface A 329, 134 (2008).Google Scholar
14. Ashayer, R., Cobley, A., Mokhtari, O., Mannan, S.H., Sajjadi, S. and Mason, T., ESTC 2008: 2nd Electronics System-Integration Technology Conf., Vols. 1 and 2, Proceedings 929 (2008).Google Scholar
15. Stober, W., Fink, A. and Bohn, E., J. Colloid. Interf. Sci. 26, 62 (1968).Google Scholar
16. Pham, T., Jackson, J.B., Halas, N.J. and Lee, T.R., Langmuir 18, 4915 (2002).Google Scholar
17. Duff, D.G., Baiker, A., and Edwards, P.P., Langmuir 9, 2301 (1993).Google Scholar
18. Amirmajdi, O.M., Ashyer-Soltani, R., Clode, M.P., Mannan, S.H., Wang, Y.Q., Cabruja, E. and Pellegrini, G., IEEE T. Electron. Pa. M. 32, 265 (2009).Google Scholar
19. Bate, P., Acta Materialia, 49, 1453 (2001).Google Scholar