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Nanoindentation Characterization of Microphases i n Sn-3.5Ag Eutectic Solder Joints

Published online by Cambridge University Press:  10 February 2011

J. P. Lucas ,
A. W. Gibson ,
K. N. Subramanian  and
T. R. Bieler
J. P. Lucas
Affiliation:
Michigan State University, East Lansing, MI 48823
A. W. Gibson
Affiliation:
Michigan State University, East Lansing, MI 48823
K. N. Subramanian
Affiliation:
Michigan State University, East Lansing, MI 48823
T. R. Bieler
Affiliation:
Michigan State University, East Lansing, MI 48823
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Abstract

Nanoindentation testing was used to obtain mechanical properties on realistic Sn-Ag solder joints made with (i) eutectic Sn-3.5Ag solder and (ii) in-situ Cu6Sn5 particle reinforced, eutectic Sn-Ag matrix composite solder. The composite solder joint contained ˜20 volume percent of intentionally-added Cu6Sn5 intermnetallic particles which were ∼5 microns in size. The Cu6Sn5 particles were dispersed in-situ in eutectic Sn-3.5Ag matrix alloy as a reinforcement phase to stabilize the microstructure by acting as a non-coarsening microconstituent phase. Mechanical properties characterization and deformation behavior were assessed on the bulk microstructure and on microconstituents in the actual solder joints. Mechanical property data obtained on constituents included hardness, elastic modulus, strain rate, and creep behavior. The pushing and rotation of the reinforcement particles that often occurred when contacted by the indenter provided a means for evaluating the interfacial shear strength of reinforcement particles in the solder matrix.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 522: Symposium T – Fundamentals of Nanoindentation & Nanotribology , 1998 , 339
Copyright
Copyright © Materials Research Society 1998

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References

1. Shangguan, D. and Achari, A., IEEE/CPMT, International Electronics Mfg. Technology Svmjosium (1994) p. 25 Google Scholar
2. Glazer, J., International Materials Review, 40–2, 65 (1995)Google Scholar
3. Winterbottom, W., JOM, 45–5, 20 (1993)Google Scholar
4. Darveaux, R., Murty, K. Linga and Turlik, I., JOM, 44–7, 36 (1992)Google Scholar
5. Murty, K. Linga and Turlik, I., EEP-Vol. 1, Proc. Joint ASME/JSME Advances in Electronic Packaging edited by W. T. Chen and H. Abe, p. 309, 1992 Google Scholar
6. Jin, S., JOM, July, 45–5, 13 (1993)Google Scholar
7. Gibson, A. W., Choi, S., Bieler, T. R., and Subramanian, K. N., International Symposium on Electronics and the Environment (1997) p. 246 Google Scholar
8. Morris, J. W. Jr. Second Pacific Rim International Conference on Advanced Materials and Processing, edited. Shin, K. S. et. al. (1995) p. 715 Google Scholar
9. Gibson, A. W. Choi, S., Bieler, T. R., and Subramanian, K. N., Design and Reliability of Solders and Solder Interconnects, edited by Mahidhara, R. K. et. al., TMS (1997) p. 97 Google Scholar
10. Govila, R.. Jih, E., Pao, Y. and Larner, C., J. of Electronic Packaging, 116–2, 83 (1994)Google Scholar
11. Moody, N. R., private communication, Sandia National Labs, Livermore, CA.Google Scholar
12. Oliver, W. C. and Pharr, G. M., J. Mat. Res. 7, 1564 (1992)Google Scholar
13. Doerner, M. F. and Nix, W.D., J. Mat. Res. 1,601 (1986)Google Scholar
14. Nix, W. D., Metall. Trans. A. 20A, 2217 (1989)Google Scholar
15. Mayo, M. J. and Nix, W. D., Acta Metall, 36, 2183 (1988)Google Scholar
16. Mayo, M. J. and Nix, W. D., Proc. International Conference on Strength of Metals edited by P. O. Kettunen, T. K. Lepisto, and M. E. Lehtonen, (1988) p. 1415 Google Scholar
17. Mavoori, H., Vaynman, S., Chin, J., Moran, B., Keer, L. M. and Fine, M. E., Mat, Res, Soc. Sym. Proc 390 (1986) p. 161 Google Scholar
18. Subramanian, K. N., Bieler, T. and Lucas, J., unpublished research, Solder Research Group, Michigan State UniversityGoogle Scholar