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Nanoindentation and Tensile Behavior of Copper Films

Published online by Cambridge University Press:  10 February 2011

D. Read ,
R. Geiss ,
J. Ramsey ,
T. Scherban ,
G. Xu ,
J. Blaine ,
B. Miner  and
R.D. Emery
D. Read
Affiliation:
National Institute of Standards and Technology, Boulder, CO 80305
R. Geiss
Affiliation:
National Institute of Standards and Technology, Boulder, CO 80305
J. Ramsey
Affiliation:
Reed College, Portland, OR 97202
T. Scherban*
Affiliation:
Logic Technology Development Quality & Reliability, Intel Corp., Hillsboro, OR 97124
G. Xu
Affiliation:
Logic Technology Development Quality & Reliability, Intel Corp., Hillsboro, OR 97124
J. Blaine
Affiliation:
Logic Technology Development Quality & Reliability, Intel Corp., Hillsboro, OR 97124
B. Miner
Affiliation:
Logic Technology Development Quality & Reliability, Intel Corp., Hillsboro, OR 97124
R.D. Emery
Affiliation:
Components Research, Intel Corp., Chandler, AZ 85226
*
†Corresponding author: 503.613.1716, [email protected]
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Abstract

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 778: Symposium U – Mechanical Properties Derived from Nanostructuring Materials , 2003 , U4.3
Copyright
Copyright © Materials Research Society 2002

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