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Nanoindentation Analysis of Viscoelastic Thin Films: Strain Rate and Adhesion Effects

Published online by Cambridge University Press:  21 March 2011

Manuel Luis B. Palacio ,
Tracey Scherban ,
Brad Sun ,
Jessica Xu  and
William W. Gerberich
Manuel Luis B. Palacio
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN
Tracey Scherban
Affiliation:
Intel Corporation, Hillsboro, OR
Brad Sun
Affiliation:
Intel Corporation, Santa Clara, CA
Jessica Xu
Affiliation:
Intel Corporation, Hillsboro, OR
William W. Gerberich
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN
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Abstract

The mechanical properties of two viscoelastic thin films were measured, a polyimide and a low-k polymer dielectric. The static modulus and hardness were obtained from nanoindentation experiments using an elastic-plastic unloading model (J. Mater. Res., 13, 421 (1998)). Nanoindentation creep tests were also performed, where a value for the modulus was extracted by fitting the data to an equation based on the three-element standard linear solid model. Aside from being comparable to values reported in the literature, the moduli from creep experiments are at most 1.3 times lower than the static moduli. This decrement can be attributed to the differences in strain rate for the two methods and the effect of adhesive forces.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L3.15.1
Copyright
Copyright © Materials Research Society 2002

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References

REFERENCES

1. Seshan, K., Scepis, D. J., Rothman, L. R.. “Organic Dielectrics in Multilevel Metallization of Integrated Circuits” in Handbook of Multilevel Metallization for Integrated Circuits: Materials, Technology and Applications. Wilson, S. R., Tracy, C. J., Freeman, J. L. Jr, eds. (Noyes Publications, 1990)Google Scholar
2. Grunlan, J., Xia, X., Rowenhorst, D., Gerberich, W. W., Rev. Sci. Inst., 72, 1 (2001).Google Scholar
3. Gerberich, W.W., Yu, W., Kramer, D., Strojny, A., Bahr, D., Lilleoden, E., J. Nelson, J. Mater. Res., 13, 421 (1998).Google Scholar
4. Cheng, L., Xia, X., Scriven, L. E., Gerberich, W. W., J. Polym. Sci., submitted for publication (2001).Google Scholar
5. Findley, W.N., Lai, J.S., Onaran, K.. Creep and Relaxation of Nonlinear Viscoelastic Materials with an Introduction to Linear Viscoelasticity. (North Holland, 1976)Google Scholar
6. Xia, X., Micro/Nanoprobing Measurement of Polymer Coating/Film Mechanical Properties, (Ph.D. thesis, Univ. of Minnesota, 2000)Google Scholar
7. Tsui, T. Y. and Pharr, G. M., J. Mater. Res., 14, 292 (1999).Google Scholar
8. Verbicky, J. W.. “Polyimides.” in Encyclopedia of Polymer Science and Engineering Mark, H.R., Bikales, N. M., Overberger, C. G., Menges, G., Kroschwitz, J. I., eds. (Wiley, 1985)Google Scholar
9. Nielsen, L. E. and Landel, R. F.. Mechanical Properties of Polymers and Composites. 2nd ed. (Dekker, 1994)Google Scholar