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Multiple Layer Sputter Deposition and Laser Annealing of Silicon Films

Published online by Cambridge University Press:  22 February 2011

W. W. Anderson
Affiliation:
Lockheed Missiles and Space Company, Inc., Sunnyvale, CA 94086
H. F. Mac Millan
Affiliation:
Lockheed Missiles and Space Company, Inc., Sunnyvale, CA 94086
J. S. Katzeff
Affiliation:
Lockheed Missiles and Space Company, Inc., Sunnyvale, CA 94086
M. Lopez
Affiliation:
Lockheed Missiles and Space Company, Inc., Sunnyvale, CA 94086
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Abstract

The formation of single crystal multiple layers on silicon substrates with thicknesses in excess of 1 μm has been demonstrated to be a viable process. Film build-up is via repetitions of the steps (1) pre-deposition chemical cleaning of wafer, (2) magnetron sputter deposition of 0.3 pm thick amorphous Si, (3) interfacial mixing via 190 keV implantation of Si, and (4) film epitaxial crystallization via pulsed laser annealing. Doping has been demonstrated by both (1) P ion implantation and (2) P incorporation from PH3; included in the sputter gas ambient.

Type
Research Article
Copyright
Copyright © Materials Research Society 1984

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References

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