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Multiple Cracks of a Thin Film on a Ductile Substrate

Published online by Cambridge University Press:  21 March 2011

Ming-Hao Zhao ,
Ran Fu  and
Tong-Yi Zhang
Ming-Hao Zhao
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
Ran Fu
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
Tong-Yi Zhang
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
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Abstract

The present work proposes a Dugdale type model to theoretically predict the multiple cracks of a residually tensile stressed thin film on a ductile substrate. The results show that there exists a critical value, Rc, of the cracking resistance number, R. When R < R, the film > c cracks and the normalized crack spacing is determined by cracking resistance number and the stress ratio of the residual stress to the yield strength of the substrate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L9.3.1
Copyright
Copyright © Materials Research Society 2002

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References

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