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Multilayer Ceramics

Published online by Cambridge University Press:  22 February 2011

Bernard Schwartz*
Affiliation:
IBM Corporation T. J. Watson Research Center Yorktown Heights, N. Y. 10598
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Abstract

Multilayer ceramics (MLC) technology is the basis for several major products today, which include capacitors and packages for integrated circuits. This technology was originally developed to produce miniature capacitors for the micromodule program. When these goals were achieved, new applications in packaging were found. The MLC technology is now the building block in IBM's medium and large computers. The current state of this technology will be described. It's advancement will require improved understanding of the sciences involved in each of the process steps. Several of these technical areas will be discus-ed, particularly the relationships among the electrical properties of the materials and the performance of the package. As the dimensions become smaller, more concern will have to be shown for the defect levels. This implies improved control of material preparation and processing.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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References

1. Schwartz, B., “Microelectronics Packaging,” Electronic Ceramics: Amer. Ceram. Soc. Publ. No. 3, pp 12–25 (3 May 1969).Google Scholar
2. Schwartz, B., “Microelectronics Packaging II,” Amer. Ceram. Soc. Bull., 63(4) 577581 (1984).Google Scholar
3. Schwartz, B., “Review of Multilayer Ceramics for Microelectronics Packaging,” J. Phys. Chem. Solids, (to be published).Google Scholar
4. Mistler, R. E., Shanefield, D. J. and Runk, R. B., “Tape Casting of Ceramics,” Ceramic Processing Before Firing, (Ed. by Onoda, G. Y. Jr. and Hench, L. L.) pp. 411448, Wiley, NY (1978)Google Scholar
5. Park, J. L. Jr. U.S. Patent No. 2,966,719 (3 Jan. 1961).Google Scholar
6. Stetson, H., U.S. Patent No. 3,189, 978 (22 June 1965).Google Scholar
7. Shimada, Y. et. al., “Low Firing Multilayer Glass-Ceramic Substrate,” “IEEE Trans. Comp. Hybrids, Mfg. Tech.,” Vol. CHMT–6, No. 4, 382388 (Dec. 1983).Google Scholar
8. Iwase, N., et. al., “Development of A High Thermal Conductive Substrate Technology,” IMC 1984 Procedings, pp. 180–185 (May 21–23, 1984 ).Google Scholar