Hostname: page-component-78c5997874-g7gxr Total loading time: 0 Render date: 2024-11-20T01:45:04.337Z Has data issue: false hasContentIssue false

Monte Carlo Simulation of Optical Temperature Sensors in RTP Systems

Published online by Cambridge University Press:  15 February 2011

J. Vernon Cole
Affiliation:
Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Karson L. Knutson
Affiliation:
AG Associates, 1325 Borregas Avenue, Sunnyvale, CA 94089
Anthony T. Fiory
Affiliation:
AT&T Bell Laboratories, 600 Mountain Avenue, Murray Hill, NJ 07974
Klavs F. Jensen
Affiliation:
Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Get access

Abstract

We present simulation and experimental results for determining the distribution of radiation throughout an RTP system and evaluating the design of optical temperature sensors. The simulations are performed with a general purpose, three dimensional Monte Carlo method. The simulation models internal reflection, absorption, and transmission within participating media explicitly, and includes wavelength, temperature, and material dependent properties. Simulation results are compared to measurements of the lamp intensity profile within the lamphouse and at possible sensor locations. Simulations are used to examine the effect of several optical probe designs. The predicted responses of potential sensor designs resulting from these studies are presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Stein, A. in 2nd International Rapid Thermal Processing Conference, edited by Fair, R. B. and Lojek, B. (RTP '94, Round Rock, TX, 1994) pp. 178–181.Google Scholar
2. Burckel, D., Zaidi, S.H., Lang, M.K., and Frauenglass, A. in Rapid Thermal and Integrated Processing III, edited by Wortman, J. J. (Mater. Res. Soc. Proc. 342, Pittsburgh, PA, 1994) pp. 1722.Google Scholar
3. Degertekin, F.L., Roche, P.E., Honein, B.V., Pei, J., Khuri-Yakub, B.T., and Saraswat, K. C. in 2nd International Rapid Thermal Processing Conference, edited by Fair, R. B. and Lojek, B. (RTP '94, Round Rock, TX, 1994) pp. 174–177.Google Scholar
4. Fiory, A. T. and Nanda, A. K. in Rapid Thermal and Integrated Processing III, edited by Wortman, J. J. (Mater. Res. Soc. Proc. 342, Pittsburgh, PA, 1994) pp. 316.Google Scholar
5. Siegel, R. and Howell, J.R., Thermal Radiation Heat Transfer, 3rd. edition, McGraw-Hill, New York (1992).Google Scholar
6. Cole, J.V., Knutson, K.L., and Jensen, K.F. in Rapid Thermal and Integrated Processing III, edited by Wortman, J. J. (Mater. Res. Soc. Proc. 342, Pittsburgh, PA, 1994) pp. 425430.Google Scholar
7. Ward, G., Computer Graphics, 26, 265 (1992).Google Scholar