Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-23T17:29:29.651Z Has data issue: false hasContentIssue false

Modifications of Defects Concentration Induced by Ammonia Flow Rate and its Effects on Gallium Nitride Grown by MOCVD

Published online by Cambridge University Press:  31 January 2011

Suresh Sundaram
Affiliation:
Vattikondala Ganesh
Affiliation:
[email protected], Anna University, Crystal growth Centre, Chennai, India
Thirugnanam Prem Kumar
Affiliation:
[email protected], Anna University, Crystal growth Centre, Chennai, India
Manavaimaran Balaji
Affiliation:
[email protected], Anna University, Crystal growth Centre, Chennai, India
Vedachala Iyer Ganesan
Affiliation:
[email protected], UGC-DAE Consortium for Scientific Reserach, Indore, India
Krishnan Baskar
Affiliation:
[email protected], Anna University, Crystal growth Centre, Chennai, India
Get access

Abstract

Optical and schottky diode characteristics of unintentionally doped GaN films grown by MOCVD were reported. GaN epilayers were grown with different V/III ratio by varying the source ammonia (NH3) flowrate. It exhibit changes in the density of threading dislocations (TDs) and reduced carbon and oxygen impurity incorporation. The density of dislocations determined from hot-wet chemical etching and atomic force microscopy show that on decreasing the ammonia flowrate, threading dislocations decreases. Low energy positron beam was employed to study the Ga vacancies in the epilayers. S-parameter vs. positron beam energy curves clearly shows increase in SL on increasing the V/III ratio indicating that the point defects trapping positron increases. Corroborative HRXRD, Photoluminescence and Hall measurements confirm the reduction in trapping defects and threading edge dislocations with reducing V/III molar ratio. The effects of such variation of compensating centres and radiative centres as a function of MOCVD growth conditions on optical properties and schottky device characteristics like radiative decay lifetime, barrier height and reverse leakage current respectively were discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Bogomolov, V.N. and Pavlova, T.M., Semiconductors 29, 826 (1995).Google Scholar
[2] Reshchikov, M.A. and Morkoc, H., Physica B 376, 428 (2006).10.1016/j.physb.2005.12.110Google Scholar
[3] Hsu, J.W.P, Manfra, M.J, Lang, D.V, Richter, S., Chu, S.N.G., Sergent, A.M, Appl. Phys. Lett. 78, 1685 (2001).10.1063/1.1356450Google Scholar
[4] Saarinen, K., Seppala, P., Oila, J., Hautojarvi, P., Corbel, C., Briot, O. and Aulombard, R. L., Appl. Phys. Lett. 73, 3253 (1998).10.1063/1.122735Google Scholar
[5] Keller, B. P., Keller, S., Kapolnek, D., Kato, M., Masui, H., Imagi, S., Mishra, U. K. and DenBaars, S. P., Electron, Lett. 31, 1102 (1995).10.1049/el:19950741Google Scholar
[6] Briot, O., Alexis, J. P., Sanchez, S., Gil, B. and Aulombard, R. L., Solid-State Electron. 41, 315 (1997).10.1016/S0038-1101(96)00235-3Google Scholar
[7] Pozina, G., Hemmingsson, C. G., Bergman, J. P., Trinh, D., Hultman, L. and Monemar, B., Superlattices Microstruct. 43, 605 (2008).10.1016/j.spmi.2007.06.014Google Scholar
[8] Arehart, A.R., Moran, B., Speck, J.S., Mishra, U.K., DenBaars, S.P., Ringel, S.A.. J. Appl. Phys. 100, 23709 (2007).10.1063/1.2219985Google Scholar