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Modification of Copper Surfaces: Effect on Adhesion at the Copper Polyimide Interface
Published online by Cambridge University Press: 21 February 2011
Abstract
Copper surfaces were derivatized resulting in the formation of Mx[Cu(II)(CN)Fe(II/III)(CN)5] at the interface. Polyimides were spin coated onto the modified metal surfaces and the degree of adhesion measured by the tape pull test. Effects of mechanical interlocking were evident in the case of modified copper samples, due to derivatization by ferricyanide. The chemical bonding and elemental analyses of the interfaces were studied by XPS and SEM.
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- Copyright © Materials Research Society 1988
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