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MOCVD of Ferroelectric Thin Films

Published online by Cambridge University Press:  01 February 2011

C. E. Rice
Affiliation:
Structured Materials Industries, Inc., 201 Circle Drive North, Unit 102/103, Piscataway, NJ 08854
S. Sun
Affiliation:
Structured Materials Industries, Inc., 201 Circle Drive North, Unit 102/103, Piscataway, NJ 08854
J. D. Cuchiaro
Affiliation:
Structured Materials Industries, Inc., 201 Circle Drive North, Unit 102/103, Piscataway, NJ 08854
L. G. Provost
Affiliation:
Structured Materials Industries, Inc., 201 Circle Drive North, Unit 102/103, Piscataway, NJ 08854
G. S. Tompa
Affiliation:
Structured Materials Industries, Inc., 201 Circle Drive North, Unit 102/103, Piscataway, NJ 08854
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Abstract

We have examined the growth of a number of important ferroelectric oxides by MOCVD using a rotating disk reactor. Highly uniform and reproducible films over 6” wafers have been routinely achieved. Materials include Lead Zirconate Titanate (PZT, PbZrxTi1-xO3), Lead Lanthanum Zirconate Titanate (PLZT), Strontium Bismuth Tantalate (SBT), CeMnO3 (CMO), and others. Emphasis has been on achieving highly crystalline and oriented films at the lowest deposition temperatures possible, for compatibility with other integrated device materials and processing; and the achievement of optimum ferroelectric and pyroelectric performance. The effects of varying growth parameters, barrier and/or template layers, and post-growth annealing have been studied. The growth process, physical characterization, and ferroelectric film properties will be discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

1 “Low Temperature PZT Film by MOCVD” C.E. Rice, J.D. Cuchiaro, S. Sun, L.G. Provost, G.S. Tompa, H. Beratan, C. Hanson, and H. Tanner, Proceedings of 15th ISIF, Boulder, CO, 2003.Google Scholar
2 “Deposition Condition of Epitaxially Grown PZT Films by CVD”, H. Funakubo, K. Imashita, K. Matsuyama, K. Shinosaki, and N. Mizutani, J. Ceram. Soc. Jpn. 102, 795 (1994).Google Scholar
3 “Low Temperature Deposition of Pb(Zr,Ti)O3 Films by Source Gas Pulse-Introduced Metalorganic Chemical Vapor Deposition”, M. Aratani, T. Ozeki, and H. Funakubo, Jpn. J. Appl. Phys. 40, L343 (2001).Google Scholar
4 “Epitaxial-grade Polycrystalline Pb(Zr,Ti)O3 Film Deposited at Low Temperature by Pulsed-metalorganic Chemical Vapor Deposition”, M. Aratani, T. Oikawa, T. Ozeki, and H. Funakubo, Appl. Phys. Lett. 79, 1000 (2001).Google Scholar
5 “Comparison of Crystal Structure and Electrical Properties of Tetragonal and Rhombohedral Pb(Zr,Ti)O3 Films Prepared at Low Temperatire by Pulsed-Metalorganic Vapor Deposition”, H. Funakubo, K. Tokita, T. Oikawa, and M. Aratani, J. Appl. Phys. 92, 5448 (2002).Google Scholar
6 “Modularized Low Temperature LNO/PZT/LNO Ferroelectric Capacitor-over interconnect (COI) FeRAM for Advanced SOC (ASOC) Application”, S. L. Lung, D. Lin, S. S. Chen, G. Wen, C. L. Liu, S. C. Lai, C. W. Tsai, T. B. Wu and R. B. Liu, Proceedings of the IEEE 2002 Custom Integrated Circuits Conference, p 479 (2002).Google Scholar