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Minimization of Di Water Consumption In Wet Clean Rinse Tanks

Published online by Cambridge University Press:  10 February 2011

J. Cook
J. Cook*
Affiliation:
Advanced Custom Technologies, Motorola, Inc., 2200 W. Broadway Road, Mesa, AZ 85202
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Abstract

The use of resistivity‐monitored dump‐rinse tanks in semiconductor wet processing allows the rinse process to be optimized, substantially reducing DI water consumption while minimizing the deleterious effects of water on bare silicon surfaces. Optimization experiments performed on the Metals wet clean hoods at ACT yielded optimum rinse cycles consisting of two or three dump cycles plus an overflow rinse to 10ΜΩ, with a calculated savings of about 40,000 gallons of DI water (about 40%) per year compared to previously accepted standards. Experiments indicate that the time required for rinsing is a competing function of the effectiveness of each dump cycle and the time required to physically perform the chosen number of dump cycles.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 447: Symposium L – Environmental, Safety, and Health Issues in IC Pro…… , 1996 , 15
Copyright
Copyright © Materials Research Society 1997

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References

1 Grundner, M., Gräf, D., Hahn, P., and Schnegg, A., Wet Chemical Treatments of Si Surfaces: Chemical Composition and Morphology. Solid State Technology. Feb. 1991, pp. 69–75.Google Scholar
2 Graf, D., Grundner, M., and Schulz, R., Reaction of Water with Hydrofluoric Acid Treated Silicon (111) and (100) Surfaces. Journal of Vacuum Science and Technology. Vol. A7, No. 3 (May/June 1989), pp. 808–813.Google Scholar
3 Higashi, G. and Chabal, Y., Silicon Surface Chemical Composition and Morphology. Chapter 10 in Handbook of Semiconductor Wafer Cleaning Technology, Ed. Kern, W., Noyes Publications, Park Ridge, NJ, 1993. pp. 484–6.Google Scholar
4 Sunada, T., Yasaka, T., Takakura, M., Sugiyama, T., Miyazaki, S., and Hirose, M., The Role of Fluorine Termination in the Chemical Stability of HF‐Treated Si Surfaces. Extended Abstracts of the 22nd Conference on Solid State Sevices and Materials. Sendai, 1990, pp. 1071–1074.Google Scholar
5 Lai, Kafai, Hao, Ming‐Yin, Chen, Wei‐Ming, and Lee, J., Surface Cleaning Effects on Reliability for Devices with Ultra‐Thin Oxides or Oxynitrides. Proceedings of the SPIE, Vol. 2334 (1994), pp. 137–143.Google Scholar
6 Eftekhari, G., Effect of Deionized Water Rinses on Leakage Current of Thin Gate Oxides Grown by Rapid Thermal Oxidation of Si. Physica Status Solidi A, Vol. 135, Issue 1 (Jan. 1993), pp. K29–K31.Google Scholar
7 Pietsch, G., Hydrogen on Si: Ubiquitous Surface Termination after Wet‐Chemical Processing. Applied Physics A. Vol. 60 (1995), pp. 347–363.Google Scholar
8 Menon, V., Clayton, A., and Donovan, R., Removing Paniculate Contaminants from Silicon Wafers: A Critical Evaluation. Microcontamination. June 1989, pp. 31–34,107–8.Google Scholar
9 Menon, V. and Donovan, R., Reviewing Particle Control Issues Associated with Silicon Wafer Cleaning. Microcontarmination, Nov. 1990, pp. 29–34, 66.Google Scholar
10 Menon, V. and Donovan, R., Measurement and Control of Paniculate Contaminants. Chapter 9 in Handbook of Semiconductor Wafer Cleaning Technology. Ed. Kern, W., Noyes Publications, Park Ridge, NJ, 1993. pp. 410–412.Google Scholar
11 Burggraaf, P., Keeping the ‘RCA’ in Wet Chemistry Cleaning. Semiconductor International. June 1994, pp. 86–90.Google Scholar
12 Kunesh, R., Mauer, J., Gow, C., Liehr, M., and Cohen, S., Evaluating Multifunction Baths in Semiconductor Wet‐Processing Equipment. Microcontamination. Feb. 1994, pp. 15–19.Google Scholar
13 Cook, J., Rhodanz, M., and Hampton, F., Dump Rinser Optimization for Wet Clean Processes, Motorola internal technical report, November 9, 1995.Google Scholar
14 Harten, T. and Folsom, D., Waste Reduction Technology Evaluations at Three Printed Wire Board Manufacturers. Processing of Advanced Materials. Vol 4 (1994), pp. 237–245.Google Scholar