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The Microstructure of Copper Films Deposited by E-Beam Evaporation onto Thin Polyimide Films

Published online by Cambridge University Press:  22 February 2011

J. T. Wetzel ,
D. A. Smith  and
G. Appleby-Mougham
J. T. Wetzel
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
D. A. Smith
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
G. Appleby-Mougham
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
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Abstract

Copper was deposited by electron beam evaporation onto both freshly cleaved bare and polyimide-coated (001) NaCl at substrate temperatures of 20°, 100°, 200° and 300°C at rates of 2 and 20,Åsec−1. For all substrate temperatures and deposition rates investigated, the Volmer-Weber mode of film growth was observed for copper both on polyimide and on NaCl. Comparisons of film growth on the two substrates for a constant substrate temperature revealed differences in film thickness at which copper became continuous or formed a completely coalesced film. It was found that copper grown on polyimide formed continuous and completely coalesced films at smaller film thicknesses than on NaCI. However once a completely coalesced film was obtained, grain growth in the copper films proceeded more rapidly on NaC1 substrates than on polyimide substrates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 271
Copyright
Copyright © Materials Research Society 1985

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References

1. Smith, D.A., Wetzel, J.T. and Taranko, A.R., Proceedings of the 1984 Fall MRS Meeting, Symposium D, Gibson, J.M. and Dawson, L.R., eds., to be publishedGoogle Scholar
2. Grovenor, C.R.M., Hentzell, H.T.G. and Smith, D.A., Acta Metallurgica, 32, 773, (1984)CrossRefGoogle Scholar