Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-26T22:05:07.199Z Has data issue: false hasContentIssue false

Microstructure and Mechanical Properties of Combinatorially Prepared Thin Film Aluminum-Silicon Nanocomposites

Published online by Cambridge University Press:  26 February 2011

Charles H. Olk
Affiliation:
[email protected], General Motors Research and Development, Materials and Processes Lab, MC 480-106-224, 30500 Mound Rd., Warren, MI, 48090-9055, United States, 5869860611, 5869863091
Michael Lukitsch
Affiliation:
[email protected], General Motors Research and Developmen, Materials and Processes Lab, MC 480-106-224, 30500 Mound Rd, Warren, MI, 48090-9055, United States
Daad B Haddad
Affiliation:
[email protected], Purdue University, School of Materials Engineering, West Lafayette, IN, 47907, United States
Get access

Abstract

e have undertaken the exploration of the AlxSi1-x systems to discover new alloys with enhanced properties. We describe the mechanical properties of thin film AlxSi1-x alloys determined through indentation experiments. Combinatorial methods were used to systematically control thin film microstructure through variations in composition and growth temperature. Discrete libraries of compositionally graded films have been sputter deposited onto silicon substrates to produce two structural phase regions: amorphous Al-Si and amorphous Si plus crystalline Al. The mechanical properties of the thin films were determined by analyzing the load-displacement traces based on the Oliver-Pharr method. X-ray diffraction was used to investigate the microstructures and determine the crystallite sizes.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Cibula, J., J. Inst. Met. 76, 321 (19491950).Google Scholar
2. Rao, A. K. Prasada, Das, Karabi, Murty, B. S. and Chakraborty, M., Wear, 257, 148 (2004).Google Scholar
3. McCartney, D. G., Int. Mater. Rev. 34, 247 (1989).10.1179/imr.1989.34.1.247Google Scholar
4. Oliver, W. C. and Pharr, G. M., J. Mater. Res. 7, 1564 (1992).Google Scholar
5. Olk, C. H. and Haddad, D. B., J. Mater. Res. 21, 1221 (2006).10.1557/jmr.2006.0164Google Scholar
6. Koster, U. and Weiss, P., J. Non-Crystalline Solids 17, 359 (1975).Google Scholar
7. Dimova-malinovska, D., Grigorov, V., Nikolaeva-Dimitrova, M., Angelov, O., and Peev, N., Thin Solid Films, (Article in Press).Google Scholar
8. Klein, J., Schneider, J., Muske, M., Gail, S., and Fuhs, W., Thin Solid Films, 451452, 481 (2004).Google Scholar
9. Naka, M., Shibayanagi, T., Maeda, M., Zhao, S., and Mori, H., Vacuum 59, 252 (2000).Google Scholar
10. Han, S. M., Saha, R., Nix, W. D., Acta Mater. (Article in Press).Google Scholar
11. Khayyat, M. M., Banini, G. K., hasko, G., and Chudhri, M. M., J. Phys. D: Appl. Phys. 36, 1300 (2003).Google Scholar
12. Hall, E. O., Proc. Phys. Soc., London, Sect. B 64, 747 (1951).10.1088/0370-1301/64/9/303Google Scholar
13. Petch, N. J., J. Iron Steel Inst. 173, 25 (1953).Google Scholar