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Microstructural Refinement in Single-Phase Copper Solid Solutions by Machining

Published online by Cambridge University Press:  15 March 2011

S. Swaminathan ,
S. Chandrasekar ,
W. D. Compton ,
K. P. Trumble  and
A. H. King
S. Swaminathan
Affiliation:
Schools of Engineering, Purdue University, 315 N. Grant Street, West Lafayette, IN, 47907-2023
S. Chandrasekar
Affiliation:
Schools of Engineering, Purdue University, 315 N. Grant Street, West Lafayette, IN, 47907-2023
W. D. Compton
Affiliation:
Schools of Engineering, Purdue University, 315 N. Grant Street, West Lafayette, IN, 47907-2023
K. P. Trumble
Affiliation:
Schools of Engineering, Purdue University, 315 N. Grant Street, West Lafayette, IN, 47907-2023
A. H. King
Affiliation:
Schools of Engineering, Purdue University, 315 N. Grant Street, West Lafayette, IN, 47907-2023
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Abstract

A study has been made of the effect of solute (Mn, Al, Ni) additions on microstructure refinement due to large strain deformation in single phase, copper solid solutions. The solutes were specifically selected for their influence on stacking fault energy (SFE) of copper, and the large strain deformation was imposed by chip formation in machining. The microstructure of Cu- 0.7at%Ni chip consists of elongated, sub-micrometer sized grains while Cu-7at%Al chip is made up of long, thin microbands with twins. The microstructure of the chip changes as the SFE of the material varies. With all of the solid solutions studied, the hardness of the chips is found to be significantly greater than that of the bulk material. Recrystallization temperature of solid solution chips is found to be higher than those of pure copper chips.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 821: Symposium P – Nanoscale Materials & Modeling-Relations Among Processing, Microstructure and Mechanical Properties , 2004 , P8.27
Copyright
Copyright © Materials Research Society 2004

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