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Microstructural Development in Ion Beam Assisted Evaporation of Ni, Co and Fe Films

Published online by Cambridge University Press:  25 February 2011

J.A. Trogolo ,
R.A. Roy ,
R. Petkie ,
J.J. Cuomo  and
K. Rajan
J.A. Trogolo
Affiliation:
Materials Department, Rensselaer Polytechnic Institute, Troy NY
R.A. Roy
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY
R. Petkie
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY
J.J. Cuomo
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY
K. Rajan
Affiliation:
Materials Department, Rensselaer Polytechnic Institute, Troy NY
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Abstract

The development of microstructure in metal films deposited by ion-assisted evaporation has been studied by transmission electron microscopy (TEM). Films of Ni, Co, and Fe of about 350 to 500 nm thickness were deposited by electron beam evaporation with concurrent argon ion bombardment during growth. Films grown at high ion/atom ratios develop compressive stress as revealed by lattice dilatation. The trends in grain size, orientation, and shape as a function of ion bombardment are documented by TEM.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 202: Symposium C – Evolution of Thin Film and Surface Microstructure , 1990 , 187
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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