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Microstructural Changes in Deformed Silicon Nitride and Silicon Carbide

Published online by Cambridge University Press:  25 February 2011

Nancy J. Tighe
Nancy J. Tighe*
Affiliation:
Microphase Systems Corporation, Frederick, MD 21701
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Abstract

The microstructural changes that are associated with creep in silicon nitride and silicon carbide are described and related to the creep mechanisms. Creep in hot-pressed silicon nitride and sintered silicon carbide involves mechanisms of cavitation and crack propagation within the bonding phase when the temperatures are below those necessary to activate plastic deformation within the matrix grains. In hot-pressed, magnesia doped silicon nitride the bonding phase is amorphous magnesium silicate and the creep damage involves decohesion and sliding of the matrix grains within the soft bonding phase. In yttria-doped silicon nitride the bonding phase is crystalline and diffusional interactions between this phase, the matrix and the atmosphere dominate the creep process. A similar condition is found in siliconized silicon carbide whereby the creep is controlled by the behavior of the silicon phase.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 62: Symposium Q – Materials Problem Solving with the Transmission Electron Microscope , 1985 , 435
Copyright
Copyright © Materials Research Society 1986

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References

1. Tighe, N.J. and Wiederhorn, S.M., in Fracture Mechanics of Ceramics, (Plenum Press, New York, 1983) pp 403–23.Google Scholar
2. Wiederhorn, S.M. and Tighe, N.J., J. Amer. Ceram. Soc. 66, 884–9,(1983).Google Scholar
3. Tighe, N.J., Wiederhorn, S.M., Chuang, T.-J., and McDaniel, C.L., in Deformation of Ceramic Materials II, ed. Tressler, R. and Bradt, R.,(Plenum Press, New York, 1984) pp587–604.Google Scholar
4. Fuller, E.R., Wiederhorn, S.M., Tighe, N.J. and Chuck, L., in press.Google Scholar
5. Tighe, N.J., J. Mat. Sci., 1781–86, (1978).Google Scholar
6. Clarke, D.R., J. Amer. Ceram. Soc. 60, 491–5,(1977)Google Scholar
7. Wiederhorn, S.M., Chuck, L. and Tighe, N.J., presented at 1985 Penn State Conference, in press.Google Scholar
8. Tighe, N.J., Hardman-Rhyne, K.A. and Lu, Y.N., in Ceramic Engineering and Science Proceedings, 6, 835–49, (1985).Google Scholar
9. Lewis, M.K., Heath, G.R., Winder, S.M. and Lumby, R.J., in Deformation of Ceramic Materials II, edited by Tressler, R. and Bradt, R.,(Plenum Press, New York, 1984) pp605–616 CrossRefGoogle Scholar
10. Tighe, N.J., Kuroda, K., Mitchell, T.E. and Heuer, A.H., in Electron Microscopy 1980, v. 4 High Voltage,(North Holland, edited by. Prenderoo, and Van Landuyt, J., 1980) pp 310–313.Google Scholar