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Microstructural Behavior of Poly-Si Implanted with Oxygen
Published online by Cambridge University Press: 25 February 2011
Abstract
Poly-Si layers are used for various applications in integrated-circuit manufacturing technology. In most cases, the microstructure of the layers can have a significant impact on performance of the structures. In the present study, poly-Si layers implanted with 1E14 and 1E16 oxygen cm-2 were characterized using transmission electron-microscopy (TEM). Layers implanted with 1E16 cm-2 oxygen had exhibited lower variations in sheet-resistance for a given variation in post-implant anneal temperature. The microstructural behavior of the films was therefore of interest. TEM characterization showed differences in the microstructure of poly-Si implanted with 1E14 and 1E16 oxygen cm-2. Layers implanted with 1E14 doses showed a columnar grain-structure similar to as-deposited poly-Si layers. Grain-sizes were quite uniform and relatively small. Layers implanted with 1E16 doses showed a strongly defected grain-structure quite different from as-deposited poly-Si layers. The columnar structure had been largely destroyed. Grain-sizes were less uniform, with primarily large grains but also small grains being present. There are indications that the 1E16 samples had been amorphized by the implant and recrystallized by the anneal, but it is not clear from these samples whether this is the cause for the variation in resistance-behavior (between IE 14 and IE 16 samples). TEM micrographs are indicative of the presence of oxygen-bubbles in both sets of implanted specimens. The bubbles arise due to the oxygen implant. There is no noticeable correlation between poly-Si grain-boundaries and the bubbles.
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- Copyright © Materials Research Society 1992