Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-23T08:27:24.096Z Has data issue: false hasContentIssue false

Micro-Fracture testing of Ni-W Microbeams Produced by Electrodeposition and FIB Machining

Published online by Cambridge University Press:  26 February 2011

David Armstrong
Affiliation:
[email protected], University Of Oxford, Materials Department, Parks Road, oxford, OX1 3PH, United Kingdom, 01865273768
Abdul Haseeb
Affiliation:
[email protected], Bangladesh University of Engineering and technology, Dhaka, N/A, Bangladesh
Angus Wilkinson
Affiliation:
[email protected], Oxford University, Materials Department, Parks Road, Oxford, OX1 3PH, United Kingdom
Steve Roberts
Affiliation:
[email protected], Oxford University, Materials Department, Parks Road, Oxford, OX1 3PH, United Kingdom
Get access

Abstract

Electrodeposited nickel-tungsten alloys are being considered as a candidate material for components for microelectromechanical systems (MEMS) fabricated by the LIGA (German acronym for lithography, electrodeposition, and forming) technology. In spite of having a useful range of properties including; hardness and strength, better tribological and chemical resistance and improved high temperature resistance as compared with the conventionally used electrodeposited Ni, these alloys possess certain brittleness. In this study, the fracture toughness of Ni-17.5 at%W alloy microcantilever beams (dimension: 60µm × 20µm x 14µm) fabricated by UV lithography and electrodeposition and notched by focused ion beam machining is investigated. Load was applied to the beams using a nanoindenter, which also allowed accurate positioning of the sample. Fracture toughness was calculated from the fracture load assuming a linear elastic behaviour. The Ni-W alloy beams were found to possess a mean fracture toughness of 2.97 MPa √m. The fracture toughness of Ni-W alloy is found to be higher than that of Si - another important MEMS material, but considerably lower than that of electrodeposited nickel and nickel base alloys.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Yamasaki, T.: High-Strength Nanocrystalline Ni-W Alloys Produced by Electrodeposition and Their Embrittlement Behaviors during Grain Growth. Scripta Mater., 44, 1497 (2001).Google Scholar
2. Slavcheva, E., Mokwa, W. and Schnakenberg, U.: Electrodeposition and properties of NiW films for MEMS application. Electrochim. Acta 50, 5573 (2005).Google Scholar
3. Schuh, C. A., Nieh, T.G. and Yamasaki, T.: Hall–Petch breakdown manifested in abrasive wear resistance of nanocrystalline nickel. Scripta Mater. 46, 735 (2002).Google Scholar
4. Haseeb, A. S. M. A., Albers, U., Bade, K.: Friction and Wear Characteristics of Electrodeposited Nanocrystalline Nickel-Tungsten Alloy Films, 16th International Conference on Wear of Materials, Montreal, Canada, April 1519, 2007.Google Scholar
5. Eliaz, N., Sridhar, T.M. and Gileadi, E.: Synthesis and Characterization of Nickel Tungsten Alloys by Electrodeposition. Electrochim. Acta, 50, 2893 (2005).Google Scholar
6. Maio, D. Di and Roberts, S.G.: Measuring Fracture Toughness of Coatings using Focussed-Ion-Beam-Machined Microbeams. J. Mater, Res. 20, 299 (2005).Google Scholar
7. Takashima, K. and Higo, Y.: Fatigue and Fracture of a Ni-P amorphous Alloy Thin Film on the Micrometer Scale. Fatigue Fract. Engng. Mater. Struct. 28, 703 (2005)Google Scholar
8. Halford, T. P., Takashima, K., Higo, Y. and Bowen, P.: Fracture Tests of Microsized TiAl Specimens. Fatigue Fract. Engng. Mater. Struct. 28, 695 (2005)Google Scholar
9. Rooke, D. P. and Cartwright, D. J.: Compendium of stress intensity factors. Her majesty's Stationary Office, Uxbridge, UK, 1976 Google Scholar
10. Zhou, Q. J., He, J.Y., Li, J.X., Chu, W. Y., and Qiao, L. J.: Measurement of Fracture Toughness of Nickel Phosphorous Coatings. Mater. Lett. 60, 349 (2006)Google Scholar
11. Dai, W., Oropeza, C., Lian, K. and Wang, W.: Experimental Design and UV-LIGA Microfabrication Technology to Study the Fracture Toughness of Ni Microstructures Microsyst. Technol., 12, 306 (2006)Google Scholar
12. Thompson, A. W. and Saxton, H.J.: Structure, Strength and Fracture of Electrodeposited Nickel and Ni-Co Alloys. Metall. Trans. 4, 1599 (1973)Google Scholar
13. Ericson, F.: Hardness and Fracture Toughness of Semiconducting Materials Studied by Indentation and Erosion Techniques. Mater. Sci. Eng. A 105, 131 (1988)Google Scholar
14. Kahn, H., Tayebi, N., Balarini, R., Mullen, R. L. and Heuer, A. H.: Fracture Toughness of Polysilicon MEMS Devices. J. Sensors and Actuators, 82, 274 (2000).Google Scholar