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Microanalysis of a Copper-to-Graphite Solder Bond

Published online by Cambridge University Press:  15 February 2011

James B. Intrater
James B. Intrater*
Affiliation:
Advanced Technology, Inc., 2110 Ringwood Ave., San Jose, CA 95131
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Abstract

SEM, x-ray microprobe and EDS analysis was performed on a uniquely prepared joint of graphite soldered to copper with 60Sn-40Pb. The presented data shows a segregation of chromium out from the metallization paste to the graphite/solder interface. Dot maps of the other elemental species were also generated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 314: Symposium R – Joining and Adhesion of Advanced Inorganic Materials , 1993 , 95
Copyright
Copyright © Materials Research Society 1993

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