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Micro Feature Pad Development and Its Performance in Chemical Mechanical Planarization

Published online by Cambridge University Press:  15 March 2011

Sunghoon Lee  and
David A. Dornfeld
Sunghoon Lee
Affiliation:
Laboratory for Manufacturing Automation Department of Mechanical Engineering University of California at Berkeley Berkeley, CA 94720-1742
David A. Dornfeld
Affiliation:
Laboratory for Manufacturing Automation Department of Mechanical Engineering University of California at Berkeley Berkeley, CA 94720-1742
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Abstract

There are many elements affecting CMP performance such as the slurry, pad, process parameters and pad conditioning. Among these, the pad is considered to be one of the most important parts because of its deterioration during polishing. However, specific pad design techniques have not yet been fully investigated. In this paper, conventional polyurethane pad characteristics are investigated. A pad design based on this analysis is suggested. Prototype pads are fabricated using micro molding and are used in an experiment for examining the pad deterioration mechanism.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 816: Symposium K – Advances in Chemical-Mechanical Polishing , 2004 , K5.1
Copyright
Copyright © Materials Research Society 2004

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References

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