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A Memory Device Utilizing Resonant Tunneling in Nanocrystalline Silicon Superlattices

Published online by Cambridge University Press:  17 March 2011

Galina F. Grom
Affiliation:
Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY 14627, U.S.A
Rishi Krishnan
Affiliation:
Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY 14627, U.S.A
Philippe M. Fauchet
Affiliation:
Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY 14627, U.S.A
Leonid Tsybeskov
Affiliation:
Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY 14627, U.S.A
Bruce E. White Jr.
Affiliation:
Digital DNA Laboratories, Motorola, Austin, TX 78721, U.S.A
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Abstract

A quantum structure based on Si/SiO2 and fabricated using standard Si technology has strong potential for applications in non-volatile and scaled dynamic memories. Among standard requirements, such as long retention time and endurance, a structure utilizing resonant tunneling offers lower bias operation and faster write/read cycle. In addition, degradation effects associated with Fowlher-Nordheim (FN) hot electron tunneling can be avoided. Superlattices of nanometer size layers of silicon and silicon dioxide were obtained by sputtering. The size of the silicon nanocrystallites (nc-Si) is fixed by the thickness of the silicon layer which limits the size dispersion. A detailed analysis of the storage of charges in the dots, as a function of the nanocrystals size, is investigated using capacitance methods. Constant voltage and constant capacitance techniques are used to monitor the discharge of the structure. Room temperature non-volatile memory with retention times as long as months is evidenced.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

1. Tiwari, S., Rana, F., Hanafi, H., Hartstein, A., Crabbe, E.F., Chan, K., Appl. Phys. Lett., 68,13771379 Google Scholar
2. Tsybeskov, L., Grom, G.F., Jungo, M., Montes, L., Fauchet, P.M., McCaffrey, J.P., Baribeau, J.-M., Sproule, G.I., Lockwood, D.J., Mat. Sc. Eng. B 69–70, p. 303308 (2000)Google Scholar
3. Grom, G.F., Lockwood, D.J., McCaffrey, J.P., Labbé, H.J., Fauchet, P.M., White, B.E., Diener, J., Kovalev, D., Koch, F., Tsybeskov, L., Nature 407, p. 358361 (2000).Google Scholar
4. Tsybeskov, L. et al. , unpublished.Google Scholar
5. Kim, H.B., Montes, L., Krishnan, R., Fauchet, P.M., Tsybeskov, L., “Carrier Transport and Lateral Conductivity in Nanocrystalline Silicon Layer” (this Mat. Res. Soc. Proc.).Google Scholar