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Mechanical Properties of Platinum Films on Silicon and Glass Determined by Ultra-Microindentation

Published online by Cambridge University Press:  21 February 2011

Jaroslav Mencik
Affiliation:
CSIRO Division of Applied Physics, Lindfield NSW 2070, Department of Mechanical and Mechatronic Engineering University of Sydney, NSW 2006 Australia
Michael V. Swain
Affiliation:
CSIRO Division of Applied Physics, Lindfield NSW 2070, Department of Mechanical and Mechatronic Engineering University of Sydney, NSW 2006 Australia
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Abstract

Platinum films of thickness 0.5 - 1.2 - 3.0 μm, deposited by magnetron sputtering onto glass and silicon, were investigated using ultra-microindentation. The tests were done with a pointed (Berkovich) indenter. The values of the hardness and elastic modulus of the composite “film + substrate” and the substrates alone were obtained for various loads and depths of penetration, and used to evaluate the hardness and elastic modulus of the films. The use of various film thicknesses and substrates has enabled us to investigate in more detail the influence of the contact radius/contact depth compared to the film thickness as well as the substrate properties on the total indentation behaviour. Various approaches to the data evaluation are discussed in the paper.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

1. Blau, P.J. and Lawn, B.R. (Editors), Microindentation Techniques in Materials Science and Engineering (ASTM STP 889, 1985, ASTM, Philadelphia).Google Scholar
2. Doerner, M.F. and Nix, W.D., J. Mater. Res., 1 (4), 65016609 (1986).Google Scholar
3. Oliver, W.D. and Pharr, G.M., , J. Mater. Res., 7 (6), 15641583 (1992).Google Scholar
4. Field, J.S. and Swain, M.V., J. Mater. Res., 8, 297306 (1993).Google Scholar
5. Swain, M.V. and Mencik, J., in Unification of analytical … ed. (Pryputniewicz, Worcester Polytechnic Institute, Worcester, 1993), pp. 444454.Google Scholar
6. Mencik, J. and Swain, M.V., Materials Forum, Australia 18,227238(1994).Google Scholar
7. Bhattacharya, A.K. and Nix, W.D., Int. J. Solids Struct., 24 (12), 12871298 (1988).Google Scholar
8. Jonsson, B. and Hogmark, S., Thin Solid Films, 114, p.257 (1984).Google Scholar
9. Sargent, P.M., pp. 160–174 in [1] (1985).Google Scholar
10. Burnett, PJ. and Page, T.F., J. Mater. Sci., 19, 845860 (1984).Google Scholar
11. Burnett, PJ. and Rickerby, D.S., Thin Solid Films, 148, pp. 4165 (1987).Google Scholar
13. Fabes, B.D. and Oliver, W.C., pp. 127132, in MRS. Symp. Proc. Vol. 188, 1990 Google Scholar
14. Fabes, B.D., Oliver, E.C., McKee, R.A. and Walker, F.J., J. Mater. Res., 7 (11), 3056 (1992).Google Scholar
15. Sakai, M., Acta metall. mater., 41 (6), 17511758 (1993).Google Scholar
16. Gao, H., Chiu, C-H and Lee, J., Int. J. Solids Structures, 29 (20), 24712492, (1992).Google Scholar
17. Mencik, J. and Swain, M.V., to be publishedGoogle Scholar
18. Swain, M.V. and Mencik, J.,. Thin Solid Films, 253, 204211 (1994).Google Scholar
19. Swain, M.V. and Weppelmann, E., pp.177182 in MRS Symp. Proc. Vol. 308, 1993 Google Scholar