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Mechanical Properties of Evaporated Gold Films. Hard Substrate Effect Correction

Published online by Cambridge University Press:  01 February 2011

Ke Du
Affiliation:
[email protected], University of South Florida, Mechanical Engineering, 4202 E Fowler Ave. ENB118, Tampa, FL, 33620, United States, 813-974-5658, 813-974-3539
Xiaolu Pang
Affiliation:
[email protected], University of South Florida, Department of Mechanical Engineering, 4202 E Fowler Ave. ENB118, Tampa, FL, 33620, United States
Chi Chen
Affiliation:
[email protected], University of South Florida, Department of Mechanical Engineering, 4202 E Fowler Ave. ENB118, Tampa, FL, 33620, United States
Alex A. Volinsky
Affiliation:
[email protected], University of South Florida, Mechanical Engineering, 4202 E Fowler Ave. ENB118, Tampa, FL, 33620, United States, 813-974-5658, 813-974-3539
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Abstract

Nanoindentation tests using the Berkovich indenter tip were performed on 50 and 200 nm thick polycrystalline gold films deposited on hard substrates. Gold film hardness increased with the indentation depth due to the influence of the substrate. A procedure based on the Joslin-Oliver method was introduced to correct for the substrate effect. The method utilizes the fact that the measured elastic modulus does not change significantly with the indentation depth, which allows reducing the contact area variation used in the hardness calculation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

1 Read, D.T. and Dally, J.W., J. Mater. Res. 8 (1993) 1542.Google Scholar
2 Zhang, T.-Y., Wang, X., Huang, B., Mater. Sci. and Eng. A 409 (2005) 329.Google Scholar
3 Baker, S.P. and Nix, W.D., J. Mater. Res. 9 (1994) 3131, 3145.Google Scholar
4 Elmastafa, A.A., Stone, D.S., Acta Mater. 50 (2002) 3641.Google Scholar
5 Saha, R., Nix, W.D., Acta Mater. 50 (2002) 23.Google Scholar
6 Zhao, M., Chen, X., Xiang, Y., Vlassak, J.J., Lee, D., Ogasawara, N., Chiba, N., Gan, Y.X., Acta Mater. 55 (2007) 6260.Google Scholar
7 Pharr, G.M., Oliver, W.C., and Brotzen, F., J. Mater. Res. 1 (1986) 601.Google Scholar
8 Joslin, D.L., Oliver, W.C., J. Mater. Res. 5 (1990) 123.Google Scholar
9 Han, S.M., Saha, R., Nix, W.D., Acta Mater. 54 (2006) 1571.Google Scholar
10 King, R.B., Int. J. Solid. Struct. 23 (1987) 1657.Google Scholar
11 Kramer, D.E., Volinsky, A.A., Moody, N.R. and Gerberich, W.W., J. Mater. Res. 16 (2001) 3150.Google Scholar