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Mechanical Properties and Stresses in Thin Gold Films on a Silicon Substrate

Published online by Cambridge University Press:  21 March 2011

Changjin Xie ,
Richard D. Emery ,
Seung-Yong Yang  and
Wei Tong
Changjin Xie
Affiliation:
Department of Mechanical Engineering, Yale University, New Haven, CT
Richard D. Emery
Affiliation:
Component Research, Intel Corp., Chandler, AZ
Seung-Yong Yang
Affiliation:
Department of Mechanical Engineering, Yale University, New Haven, CT
Wei Tong
Affiliation:
Department of Mechanical Engineering, Yale University, New Haven, CT
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Abstract

Thin gold films with a thickness of 2mm were deposited on a silicon substrate by electron-beam evaporation. The material microstructure and internal stresses of the as-deposited gold films were characterized by scanning ion microscopy, orientation imaging microscopy, and X-ray diffraction. Microtensile tests of free-standing gold film samples were carried out to establish their intrinsic mechanical properties (in connection with a finite element analysis using crystal plasticity). Nanoindentation tests of the thin gold films attached to the silicon substrate were also carried out. Finite element analyses incorporating the crystal plasticity model were used to evaluate the effects of thin film textures, constraints due to the elastic substrate, and internal stresses on the plastic deformation behavior of the thin gold films under indentation at a direction normal to the film surfaces. Results of the combined experimental and numerical investigation indicate that the internal stresses have a strong effect on the uniaxial compression stress-strain behavior of the gold films and it may contribute to the relatively large hardness numbers obtained from the nanoindentation tests.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L5.2.1
Copyright
Copyright © Materials Research Society 2002

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References

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