Hostname: page-component-cd9895bd7-lnqnp Total loading time: 0 Render date: 2024-12-27T01:30:17.329Z Has data issue: false hasContentIssue false
  • English
  • Français

Mechanical Characteristics of Al-Si-Cu Structural Films by Uniaxial Tensile Test with Elongation Measurement Image Analysis

Published online by Cambridge University Press:  01 February 2011

Hiroki Fujii ,
Takahiro Namazu ,
Yasushi Tomizawa  and
Shozo Inoue
Hiroki Fujii
Affiliation:
[email protected][email protected], University of Hyogo, Himeji, Japan
Takahiro Namazu
Affiliation:
[email protected], University of Hyogo, Himeji, Hyogo, Japan
Yasushi Tomizawa
Affiliation:
[email protected], Toshiba Corporation, Kawasaki, Kanagawa, Japan
Shozo Inoue
Affiliation:
[email protected], University of Hyogo, Himeji, Hyogo, Japan
Get access

Abstract

This paper presents mechanical characteristics of sputtered Al-Si-Cu film used as a structural material in microelectromechanical systems (MEMS). Novel tensile test technique with an elongation measurement image analysis system has been developed. Uniaxial tensile tests were conducted at temperatures ranging from room temperature (R.T.) to 358 K. No specimen-size effect on Young's modulus, yield stress, and fracture strength, was found, whereas the annealing and temperature effects were clearly observed. To study mechanical degradation mechanism, cyclic loading tests were conducted under constant stress- and strain-amplitude modes. In constant stress-amplitude mode, stain amplitude increased with an increase of loading cycles due to creep-like deformation. Almost of the specimens fractured during the tests. Meanwhile, in constant strain-amplitude mode, stress amplitude gradually decreased with increasing cycles due to stress-relaxation, but no fatigue failure was observed.

Keywords

microelectro-mechanical (MEMS)Alstrength
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1129: Symposium V – Materials and Devices for Smart Systems III , 2008 , 1129-V14-06
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Nagai, Y., et al., “Development of Bi-Axial Tensile Tester to Investigate Yield Locus for Aluminum Film under Multi-Axial Stresses”, Proc. of MEMS 2008, pp. 443–446 (2008).Google Scholar
2. Gaspar, J., et al., “Comparison of improved bulge and microtensile techniques for mechanical thin film characterization – application to polysilicon”, Proc. of Transducers 2007, pp. 575–578, (2007).Google Scholar
3. Isono, Y., et al., “Development of AFM Tensile Test Technique for Evaluating Mechanical Properties of Sub-Micron Thick DLC Films”, J. MEMS, Vol. 15, No. 1, pp. 169–180, (2006).Google Scholar
4. Namazu, T., et al., “Thermomechanical Tensile Characterization of Ti-Ni Shape Memory Alloy Films for Design of MEMS Actuator”, Sensors and Actuators A, Vol. 139, No. 1, pp. 178–186, (2007).Google Scholar